tag: Cadence

Chip Industry Week in Review
By The SE Staff - 09 May, 2025 - Comments: 0

The U.S. government is rescinding a Biden-era AI export rule that would have imposed complex restrictions on how U.S. chip and AI technology is sold abroad, a move welcomed by companies like Nvidia, reports Bloomberg. While new, simpler guidelines are expected in the coming months, the decision introduces short-term uncertainty for firms currently navigating export deals. SEMI-Europe is call... » read more

Radiation, Temperature, Power Challenges For Chips In Space
By Liz Allan - 07 May, 2025 - Comments: 0

Mission-critical hardware used in space is not supposed to fail at all, because lives may be lost in addition to resources, availability, performance, and budgets. For space applications, failure can occur due to a range of factors, including the weather on the day of launch, human error, environmental conditions, unexpected or unknown hazards and degradation of parts to chemical factors, aging... » read more

Blog Review: May 7
By Jesse Allen - 07 May, 2025 - Comments: 0

Cadence’s Mayank Bhatnagar examines the challenge of ensuring the functional safety of disaggregated designs and how UCIe can serve as a certified way to connect individual components. Siemens’ Charlie Olson explores the causes of inter-domain leakage when a DC path is formed between two power rails and how to overcome the limitations of traditional electrical rule checking. Synopsys�... » read more

Three-Way Race To 3D-ICs
By Ed Sperling - 05 May, 2025 - Comments: 0

Intel Foundry, TSMC, and Samsung Foundry are scrambling to deliver all the foundational components of full 3D-ICs, which collectively will deliver orders of magnitude improvements in performance with minimal power sometime within the next few years. Much attention has been focused on process node advances, but a successful 3D-IC implementation is much more complex and comprehensive than just... » read more

Chip Industry Week in Review
By The SE Staff - 02 May, 2025 - Comments: 0

Check out the Inside Chips podcast for our behind-the-scenes analysis of changes at Intel Foundry. Intel rolled out its updated process technology roadmap this week, along with early process design kit (PDK) for its 14A gate-all-around process technology. That node will utilize high-NA EUV, and include direct contact power delivery, the second generation of its backside power delivery techno... » read more

eMMC: The Embedded Storage Powering On-Device AI
By Dharini Subashchandran - 01 May, 2025 - Comments: 0

In today's world of increasingly intelligent devices, efficient and reliable storage is paramount. Embedded MultiMediaCard (eMMC) has emerged as a crucial component that acts as the internal solid-state non-volatile storage for a wide range of devices handling on-device AI processing. Think of it as a compact, high-performing internal drive built directly into your phone, smart camera, or other... » read more

Extra Safety Measures Needed For Aerospace ICs
By Liz Allan - 01 May, 2025 - Comments: 0

Aerospace safety requirements and standards vary depending on whether a spacecraft is manned or unmanned, and how crucial the mission is. The defense contractors designing these spacecraft take various approaches to functional safety based on how critical a component is for the mission to succeed. While losing a few images during an Earth-bound observation may not matter, losing a satellite ... » read more

Smarter Cars, Higher Stakes
By Sascha Brodsky - 01 May, 2025 - Comments: 0

Artificial intelligence is turbocharging automotive innovation, but it's also unleashing a tangle of high stakes risks that engineers and security experts are scrambling to contain. The push to embed AI deep into today’s vehicles is changing how cars are built, how they handle the road, and how they keep passengers safe. But as onboard intelligence expands, so do the risks. AI systems that... » read more

From Tool Agents To Flow Agents
By Brian Bailey - 30 Apr, 2025 - Comments: 0

Experts At The Table: AI is starting to impact several parts of the EDA design and verification flows, but so far these improvements are isolated to single tool or small flows provided by a single company. What is required is a digital twin of the development process itself on which AI can operate. Semiconductor Engineering sat down with a panel of experts to discuss these issues and others, in... » read more

Blog Review: Apr. 30
By Jesse Allen - 30 Apr, 2025 - Comments: 0

Cadence’s Sree Parvathy points out how electrothermal analysis can help designers understand how temperature changes affect device behavior, such as mobility, threshold voltage, and saturation to mitigate potential failures due to thermal overstress. In a podcast, Siemens’ Conor Peick, Dale Tutt, and Mike Ellow chat about the transition towards software-defined products and why companies... » read more

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