Blog Review: Oct. 23


Cadence’s Sanjeet Kumar introduces the message bus interface in the PHY Interface for the PCIe, SATA, USB, DisplayPort, and USB4 Architectures (PIPE) specification, which provides a way to initiate and participate in non-latency-sensitive PIPE operations using a small number of wires. Siemens’ Dennis Brophy argues that the recently published Portable Test and Stimulus Standard (PSS) 3.0 ... » read more

Chip Industry Week In Review


Arm joined forces with Korea's Samsung Foundry, ADTechnology, and Rebellions to create a CPU chiplet platform for AI training and inference. The new chiplet will be based on Samsung's 2nm gate-all-around technology. Intel and AMD, arch competitors for decades, formed an x86 ecosystem advisory group to collaborate on architectural interoperability and simplify software development. Samsung... » read more

How Big A Deal Is Aging?


Nothing lasts forever, but in the semiconductor world things used to last long enough to become obsolete long before their end of life. That's no longer the case with newer nodes, and it is raising concerns in safety-critical markets such as automotive. Being able to fully understand what happens inside of chips is still a work in progress, and analysis approaches are trying to keep up. Unti... » read more

Is Liquid Cooling Right For Your Data Center?


We live in an exciting time—liquid cooling, which once seemed more trouble than it’s worth, is fast becoming an accepted and sought-after technology in the data center industry. That said, it’s still a complex technology to implement, especially in legacy facilities. Is your data center ready to operationalize liquid cooling? Liquid cooling in the data center Liquid cooling in the d... » read more

Mass Customization For AI Inference


Rising complexity in AI models and an explosion in the number and variety of networks is leaving chipmakers torn between fixed-function acceleration and more programmable accelerators, and creating some novel approaches that include some of both. By all accounts, a general-purpose approach to AI processing is not meeting the grade. General-purpose processors are exactly that. They're not des... » read more

Data Center Digital Twin Return On Investment From An Environmental Standpoint


Data center operators face growing pressure to enhance sustainability. Understanding where inefficiencies occur is the first step toward making impactful changes. Cadence Reality DC Digital Twin helps you identify inefficiencies, implement solutions, and track improvements. This white paper reveals how Cadence Reality DC Digital Twin can save an average of 316MWh annually, delivering a retur... » read more

Chip Industry Week In Review


Imec announced a new automotive chiplet consortium to evaluate which different architectures and packaging technologies are best for automotive applications. Initial members includes Arm, ASE, Cadence, Siemens, Synopsys, Bosch, BMW, Tenstorrent, Valeo, and SiliconAuto. Imec also launched star, a global network bringing together automotive and semiconductor innovators to address technological c... » read more

Partial Header Encryption In Integrity And Data Encryption For PCIe


Partial Header Encryption (PHE) is an additional mechanism added to Integrity and Data Encryption (IDE) in PCIe 6.0 to prevent side-channel attacks based on attacker analysis of the information included in the headers. This blog narrates PHE flow and Cadence VIP support for PHE in IDE across PCIe/CXL protocols. Background Introducing PCIe's Integrity and Data Encryption Feature is an excell... » read more

Challenges In Reducing Wireless Latency


A new and much faster version of Wi-Fi is beginning to infiltrate the IoT market, reducing latency that has begun to creep up as more data is generated, processed, and moved wirelessly from one device to another. An estimated 20 billion connected devices are currently in use. Over the next several years, devices will start to include faster wireless connectivity, enabling more rapid transfer... » read more

Managing Legacy In Automotive


Experts At The Table: The automotive ecosystem is in the midst of an intense evolution as OEMs and tiered providers grapple with how to deal with legacy technology while incorporating ever-increasing levels of autonomy, electrification, software defined vehicle concepts, just to name a few. Semiconductor Engineering sat down to discuss these and other related issues with Wayne Lyons, senior dir... » read more

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