tag: Cadence

Autonomous Vehicles: Not Ready Yet
By John Koon - 27 Nov, 2023 - Comments: 0

The swirl of activity around L4 and L5 vehicles has yet to result in a successful demonstration of an autonomous vehicle that can navigate the streets of a city or highway without incident, and there is a growing body of real-world data showing that much work still needs to be done. Robo-taxi trials in big cities such as San Francisco, Los Angeles, and soon San Diego, are proving that autono... » read more

Chip Industry Week In Review
By The SE Staff - 17 Nov, 2023 - Comments: 0

By Jesse Allen, Karen Heyman, and Liz Allan Japan's Rapidus and the University of Tokyo are teaming up with France's Leti to meet its previously announced mass production goal of 2nm chips by 2027, and chips in the 1nm range in the 2030s. Rapidus was formed in 2022 with the support of eight Japanese companies — Sony, Kioxia, Denso, NEC, NTT, SoftBank, Toyota, and Mitsubishi's banking arm, ... » read more

Blog Review: November 15
By Jesse Allen - 15 Nov, 2023 - Comments: 0

Cadence's Neelabh Singh explores the process of lane initialization and link training in bringing up a high-speed link in USB4. Synopsys' Shela Aboud argues that TCAD should be an integral part of an EDA flow as it enhances design technology co-optimization with a way to experiment and determine what works and what doesn’t work at different process nodes using physics-based models. Siem... » read more

What Can Go Wrong In Heterogeneous Integration
By Ed Sperling - 15 Nov, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss heterogeneous integration with Dick Otte, president and CEO of Promex Industries; Mike Kelly, vice president of chiplets/FCBGA integration at Amkor Technology; Shekhar Kapoor, senior director of product management at Synopsys; John Park, product management group director in Cadence's Custom IC & PCB Group; and Tony Mastroia... » read more

DRAM Choices Are Suddenly Much More Complicated
By Ed Sperling - 13 Nov, 2023 - Comments: 0

Chipmakers are beginning to incorporate multiple types and flavors of DRAM in the same advanced package, setting the stage for increasingly distributed memory but significantly more complex designs. Despite years of predictions that DRAM would be replaced by other types of memory, it remains an essential component in nearly all computing. Rather than fading away, its footprint is increasing,... » read more

Chip Industry Week In Review
By The SE Staff - 10 Nov, 2023 - Comments: 0

By Jesse Allen, Gregory Haley, and Liz Allan Bosch, Infineon, and NXP were cleared in Germany to each acquire 10% of the European Semiconductor Manufacturing Co. (ESMC), established by TSMC, solidifying the supply chain against future shortages, particularly for automotive chips. “ESMC intends to build and operate another large semiconductor factory in Dresden, in which the three Europ... » read more

Flipping Processor Design On Its Head
By Ann Mutschler - 09 Nov, 2023 - Comments: 2

AI is changing processor design in fundamental ways, combining customized processing elements for specific AI workloads with more traditional processors for other tasks. But the tradeoffs are increasingly confusing, complex, and challenging to manage. For example, workloads can change faster than the time it takes to churn out customized designs. In addition, the AI-specific processes may ex... » read more

An Entangled Heterarchy
By Brian Bailey - 09 Nov, 2023 - Comments: 1

For decades, a form of structural hierarchy has been the principal means of handling complexity in chip design. It's not always perfect, and there is no ideal way in which to divide and conquer because that would need to focus on the analysis being performed. In fact, most systems can be viewed from a variety of different hierarchies, equally correct, and together forming a heterarchy. The e... » read more

Reduce Data Center Over-Provisioning And Stranded Capacity For Sustainability
By Hassan Moezzi - 09 Nov, 2023 - Comments: 0

In the ever-evolving landscape of data centers, the issue of stranded capacity has become a significant concern for operators. Stranded capacity refers to the underutilization of resources. It is best referred to as the elephant in the data center due to the enormity of its impact. The losses are even more significant for the enterprise data center categories at above 40%. This outcome n... » read more

Blog Review: Nov. 8
By Jesse Allen - 08 Nov, 2023 - Comments: 0

Siemens' Todd Westerhoff takes a look at the three stages of power integrity analysis for PCBs, challenges to board-level signal integrity, and best practices for getting the most accurate estimate of design performance. Synopsys' William Ruby provides a brief overview of the evolution of low-power design techniques and finds opportunities to reduce power and to make chip designs more energy... » read more

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