Experts at the Table: Stacking the Deck


By Ann Steffora Mutschler System-Level Design sat down to discuss challenges to 3D adoption with Samta Bansal, product marketing for applied silicon realization in strategy and market development at Cadence; Carey Robertson, product marketing director at Mentor Graphics; Karthik Chandrasekar, member of technical staff in IC Design at Altera; and Herb Reiter, president of Eda2Asic Consulting. ... » read more

Analog Hits The Power Wall


By Ed Sperling Analog design teams are starting to encounter the same physical issues that digital design engineers began wrestling with several nodes ago—only the problems are more complicated and even more difficult to solve. At advanced nodes digital circuitry is susceptible to an array of physical effects ranging from heat, electromigration, electromagnetic interference and electrosta... » read more

Mining For Data


By Ann Steffora Mutschler Power analysis accuracy at the RTL design abstraction is a challenging problem. Smaller geometries just make the challenge of predicting accurate RTL power consumption even more difficult, which in turn impacts other design decisions such as power-grid planning and package selection. “It’s one of these things where the earlier you are in the design, even befo... » read more

The New Frontier: Low-Power Verification And Test


By Ann Steffora Mutschler By now there’s no argument that verification and test strategies must be considered at the very earliest stages of any design cycle, and when it comes to low-power designs, the advanced techniques used and design complexity make the challenges here even more daunting. Low-power verification and test strategies have been in development for a number of years, and it... » read more

The Rise Of The Power Architect


By Ann Steffora Mutschler Call them power czars, power gurus or power architects, this role within design teams is gaining importance with the need to understand, manage and control the power budget throughout the entire design process. As such, power architects are in high demand today with power architecture teams doubling in size within a year or two. Driving the need for this highly s... » read more

Experts At The Table: Challenges At 20nm


By Ed Sperling Low-Power/High-Performance Engineering sat down to discuss the challenges at 20nm and beyond with Jean-Pierre Geronimi, special projects director at STMicroelectronics; Pete McCrorie, director of product marketing for silicon realization at Cadence; Carey Robertson, director of product marketing at Mentor Graphics; and Isadore Katz, president and CEO of CLK Design Automation. Wh... » read more

Experts At The Table: Coherency


By Ed Sperling System-Level Design sat down to discuss coherency with Mirit Fromovich, principal solutions engineer at Cadence; Drew Wingard, CTO of Sonics; Mike Gianfagna, vice president of marketing at Atrenta, and Marcello Coppola, technical director at STMicroelectronics. What follow are excerpts of that conversation. SLD: How do we bring software more in line with the hardware to impr... » read more

Experts At The Table: Pain Points


By Ed Sperling Low-Power/High-Performance Engineering sat down with Vinod Kariat, a Cadence fellow; Premal Buch, vice president of software engineering at Altera; Vic Kulkarni, general manager of Apache Design; Bernard Murphy, CTO at Atrenta, and Laurent Moll, CTO at Arteris. What follows are excerpts of that conversation. LPHP: What comes next requires a lot of guesswork in the design, do... » read more

Experts At The Table: Coherency


By Ed Sperling System-Level Design sat down to discuss coherency with Mirit Fromovich, principal solutions engineer at Cadence; Drew Wingard, CTO of Sonics; Mike Gianfagna, vice president of marketing at Atrenta, and Marcello Coppola, technical director at STMicroelectronics. What follow are excerpts of that conversation. SLD: What’s driving coherency and what sort of issues are you encou... » read more

Experts At The Table: Stacking The Deck


By Ann Steffora Mutschler There is no doubt 3D stacking brings challenges not only from the design perspective, but also on the tool side. EDA vendors have been working for more than a few years to ready tools for stacked-die designs. How smooth the transition is, however, is a big question mark. Because the approach is new, not all the challenges are fully understood yet. And while most ED... » read more

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