tag: Cadence

Multi-DRAM Memory Subsystems In SoCs
By Shyam Sharma - 14 Oct, 2021 - Comments: 0

Even with DRAM capacity going up with each generation of DRAM, the demand for memory densities by a variety of applications is growing at an even faster rate. To support these high memory densities and bus width requirements (that are typically more than what a single DRAM can support), almost all the new generation of memory subsystems and SoCs have multiple DRAM dies combined to effectively c... » read more

Rising Fortunes For ICs In Health Care
By Susan Rambo - 13 Oct, 2021 - Comments: 0

Semiconductors are increasingly finding their way into a variety of medical devices, after years of slow growth and largely consumer electronics types of applications. Nearly every major chipmaker has a toehold in health care these days, and many are starting to look beyond wearable such as the Apple Watch to devices that can be relied on for accuracy and reliability. Unlike in the past, the... » read more

Blog Review: Oct. 13
By Jesse Allen - 13 Oct, 2021 - Comments: 0

Cadence's Paul McLellan checks out what Google learned in developing multiple generations of its TPU processor, including unequal advancement of logic and memory, the importance of compiler of compatibility, and designing for total cost of ownership. Siemens EDA's Jake Wiltgen argues for the importance of linting as part of eliminating systematic failures in designs complying with ISO 26262.... » read more

Week In Review: Design, Low Power
By Jesse Allen - 08 Oct, 2021 - Comments: 0

Arteris IP plans to become a public company. It filed a registration statement with the SEC for an IPO, and intends to list on Nasdaq. The number of shares to be offered and the price range for the proposed offering have not yet been determined. Arteris IP provides network-on-chip interconnect IP, cache coherent interconnects, and packages to speed functional safety certification alongside IP d... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 08 Oct, 2021 - Comments: 0

Automotive Qualcomm and SSW Partners, an investment partnership, now have a definitive agreement to acquire advanced driver assistance systems (ADAS) company Veoneer for $37.00 per share in an all-cash transaction that equals $4.5 billion in equity value. A few months ago, Qualcomm made the proposal to Veoneer after the company already had an agreement in place with Magma, a 60-year-old automo... » read more

Competing Auto Sensor Fusion Approaches
By Bryon Moyer - 07 Oct, 2021 - Comments: 0

As today’s internal-combustion engines are replaced by electric/electronic vehicles, mechanical-system sensors will be supplanted by numerous electronic sensors both for efficient operation and for achieving various levels of autonomy. Some of these new sensors will operate alone, but many prominent ones will need their outputs combined — or “fused” — with the outputs of other sensor... » read more

Security Risks Grow With 5G
By John Koon - 07 Oct, 2021 - Comments: 0

5G mobile phones can download a movie in seconds rather than minutes, but whether that can be done securely remains to be seen. What is clear from technology providers, though, is they are taking security very seriously with this new wireless technology. More data is in motion, and the value of that data is growing as users rely on mobile devices for everything from banking to automotive saf... » read more

Implementing An AES Cipher On Application-Specific Processors
By Sriram Sharma Kalluri - 07 Oct, 2021 - Comments: 0

In the previous blog post, “Embedded Security Using Cryptography”, we looked at how cryptography can be used for securing assets in embedded systems and ensure confidentiality, integrity and authenticity, or in short “CIA”. In this blog, we will explore the Advanced Encryption Standard (AES) and how to implement an AES engine on Cadence Tensilica Xtensa application-specific processors. ... » read more

Fast And Simple Rigid-Flex PCB Bending EM Analysis Using Clarity 3D Solver
By Cadence - 06 Oct, 2021 - Comments: 0

3D PCB Electromagnetic (EM) Bending Analysis Rigid-Flex PCBs have been used in many modern electronic devices (such as mobile phones, laptops, and wearables, among others), due to their form factor, light weight, and cost-effectiveness. Electromagnetic (EM) analysis of Rigid-Flex PCBs has always been a challenging task for many commercially available 3D numerical solver technologies (FEM and F... » read more

Blog Review: Oct. 6
By Jesse Allen - 06 Oct, 2021 - Comments: 0

Arizona State University's Jae-sun Seo and Arm's Paul Whatmough introduce a fully-parallel and fully-pipelined FPGA accelerator for sparse CNNs that can eliminate off-chip memory access and also efficiently support elementwise pruning of CNN weights. Cadence's Paul McLellan highlights trends seen at the recent Hot Chips, from machine learning and advanced packaging driving higher performance... » read more

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