SoC Integration Headaches Grow


As the number of IP blocks grows, so do the headaches of integrating the various pieces and making sure they perform as planned within a prescribed power envelope. This is easier said than done, particularly at the most advanced process nodes. There are more blocks, more power domains, more states and use-model dependencies, and there is much more contention for memories. There are physical ... » read more

Memory Design At 16/14nm


As we get older the memory may start to fade, but that is not a viable option if we are talking about embedded memory. Chips contain increasing amounts of memory, and for many designs memory consumes more than half of the total chip area. “At 28nm we saw a few people with greater than 400Mbits of memory on chip,” says Prasad Saggurti, product marketing manager for Embedded Memory IP at [... » read more

Power Management Verification Requires Holistic Approach


Semiconductor Engineering sat down to discuss power management [getkc id="10" kc_name="Verification"] issues with Arvind Shanmugavel, senior director, applications engineering at [getentity id="22021" e_name="Ansys-Apache"]; Guillaume Boillet, technical marketing manager at [getentity id="22026" e_name="Atrenta"]; Adam Sherer, verification product management director at [getentity id="22032" e_... » read more

Rethinking Power


Power typically has been the last factor to be considered in the PPA equation, and it usually was somebody else's problem. Increasingly it's everyone's problem, and EDA companies are beginning to look at power differently than in the past. While the driving forces vary by market and by process node, the need to save energy at every node and in almost all designs is pervasive. In the server m... » read more

Trouble Ahead For IP industry?


[getkc id="106" kc_name="Power-aware design"] has risen from an afterthought to a primary design constraint for some design types. Initially it was smart phones and other battery operated devices. It has consistently expanded into additional areas including those plugged into the wall and those plugged into the grid. Some parts of the world are imposing restrictions on the power that a device c... » read more

Accelerating Development For LP


Power is a limiting factor in all devices these days, and while most of the industry has seen this coming for several process nodes and a succession of mobile devices with limited battery life, the power problem remains a work in progress. No matter how much progress is made—and there has been plenty of work done in the areas of multiple power domains, dark silicon, dynamic voltage and fr... » read more

Power Management Verification Requires Holistic Approach


Semiconductor Engineering sat down to discuss power management [getkc id="10" kc_name="Verification"] issues with Arvind Shanmugavel, senior director, applications engineering at [getentity id="22021" e_name="Ansys-Apache"]; Guillaume Boillet, technical marketing manager at [getentity id="22026" e_name="Atrenta"]; Adam Sherer, verification product management director at [getentity id="22032" e_... » read more

Microarchitecture Design For Low Power


As designs move to finFET process nodes, dynamic power reduction has become a requirement. Designers have to eliminate or minimize all sources of redundant switching activity in order to reduce dynamic power in the design. In our last blog, we looked at dynamic power wastage due to redundant adders and multipliers and how to gate these operators to save power. We also mentioned a couple of m... » read more

Power Reduction At RTL: Data Gating Adders And Multipliers


In our previous blog, “Low Power Paradox”, we discussed the implications of the move to FinFET technology. Dynamic power is dominant in finFET designs. Several techniques are available to reduce dynamic power consumption. Microarchitecture changes are one method and they can result in significant power savings. One technique that is frequently used is the data gating of adders and m... » read more

Stacked Die, Phase Two


The initial hype phase of [getkc id="82" kc_name="2.5D"] appears to be over. There are multiple offerings in development or on the market already from Xilinx, Altera, Cisco, Huawei, IBM, AMD, all focused on better throughput over shorter distances with better yield and lower power. Even Intel has jumped on the bandwagon, saying that 2.5D will be essential for extending [getkc id="74" comment="M... » read more

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