System Bits: Jan. 7

By Ann Mutschler - 07 Jan, 2014 - Comments: 0

Vanadium’s wonders Already prized for its extraordinary ability to change size, shape and physical identity, vanadium dioxide can now add muscle power to its attributes, researchers with Berkeley Lab reported. They have demonstrated a micro-sized robotic torsional muscle/motor made from vanadium dioxide that for its size is a thousand times more powerful than a human muscle, able to catapult... » read more

Manufacturing Bits: Dec. 31

By Mark LaPedus - 31 Dec, 2013 - Comments: 0

Bringing Graphene Down To Earth For years, the semiconductor industry has been looking at graphene as a next-generation technology for a multitude of applications. One potential application, the graphene field-effect transistor (GFET), has been developed by various companies and universities. There are several advantages and disadvantages with GFETs. On one hand, GFETs have a higher mobilit... » read more

Manufacturing Bits: Sept. 24

By Mark LaPedus - 24 Sep, 2013 - Comments: 0

LEGO AFM Students from the University College London (UCL), Tsinghua University and Peking University have built an atomic force microscope (AFM) or nanoscope using toy LEGOs. The AFM, dubbed LEGO2NANO, costs less than $500 to make. In contrast, traditional AFMs cost $100,000 or more. The system was made using LEGOs, Arduino controllers, 3D printed parts and consumer electronics. [captio... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Cambridge University

System Bits: Jan. 7

Manufacturing Bits: Dec. 31

Manufacturing Bits: Sept. 24