The Week In Review: IoT

By Jeff Dorsch - 10 Feb, 2017 - Comments: 0

Market Research There will be 8.4 billion connected things in use this year, a 31% gain from 2016, and leading up to 20.4 billion connected devices in 2020, according to Gartner. The market research firm estimates worldwide spending on endpoints and services will hit nearly $2 trillion in 2017. Greater China, North America, and Western Europe account for two-thirds of the IoT installed base th... » read more

Qualcomm + NXP = IoT Powerhouse

By Jeff Dorsch - 03 Nov, 2016 - Comments: 0

Coverage of the merger agreement between Qualcomm and NXP Semiconductors often focused on how the combination would yield the world’s largest supplier of chips for automotive electronics. Somewhat overlooked was its significance for the Internet of Things market. NXP CEO Rick Clemmer said in a statement, "The combination of Qualcomm and NXP will bring together all technologies required to... » read more

The Week In Review: IoT

By Jeff Dorsch - 14 Oct, 2016 - Comments: 0

Memory Kilopass Technology uncorked its new eNVM, which includes vertical layered thyristor DRAM technology. The key advantages, according to the company, is that it eliminates the need for DRAM refresh, can be manufactured using existing processes, and improves power and area efficiency. A full memory test chip is currently in the early stages of testing. A thyristor is basically a latch tech... » read more

Foundries Face Challenges in 2016

By Mark LaPedus - 17 Dec, 2015 - Comments: 2

Generally, 2015 has been a challenging year in the foundry business. For one thing, the foundry industry will register modest growth in 2015. In addition, the foundry customer base is consolidating. And on the leading edge, foundries took longer than expected to ramp up their 16nm/14nm finFET processes. So, after an eventful year in 2015, what’s in store for the foundry business in 2016? I... » read more

Searching For 3D Metrology

By Mark LaPedus - 19 Mar, 2015 - Comments: 3

In the previous decade, chipmakers made a bold but necessary decision to select the [getkc id="185" kc_name="finFET"] as the next transistor architecture for the IC industry. Over time, though, chipmakers discovered that the finFET would present some challenges in the fab. Deposition, etch and lithography were the obvious hurdles, but chipmakers also saw a big gap in metrology. In fact,... » read more

RF SOI Foundry Biz Heats Up

By Mark LaPedus - 13 Nov, 2014 - Comments: 0

The foundry business is undergoing a new round of acquisition and fab expansion activity. As before, the big foundry vendors are getting bigger, while some may fall by the wayside. And at times, the events cause some uncertainty, if not jitters, in the supply chain. For example, [getentity id="22819" comment="GlobalFoundries"]in October signed a definitive agreement to acquire the chip uni... » read more

Newer posts →

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

Defining The Chiplet Socket

The industry may have started with the wrong approach for enabling a third-party chiplet ecosystem, but who will step in and fix it?

by Brian Bailey

tag: Canaccord Genuity

The Week In Review: IoT

Qualcomm + NXP = IoT Powerhouse

The Week In Review: IoT

Foundries Face Challenges in 2016

Searching For 3D Metrology

RF SOI Foundry Biz Heats Up

Trending Articles

NAND Flash Targets 1,000 Layers

Testing For Thermal Issues Becomes More Difficult

Auto Chip Aging Accelerates In Hot Climates

Is In-Memory Compute Still Alive?

Baby Steps Toward 3D DRAM

Knowledge Centers
Entities, people and technologies explored