Inspection, Metrology Challenges Grow For SiC


Inspection and metrology are becoming more critical in the silicon carbide (SiC) industry amid a pressing need to find problematic defects in current and future SiC devices. Finding defects always has been a challenging task for SiC devices. But it’s becoming more imperative to find killer defects and reduce them as SiC device vendors begin to expand their production for the next wave of a... » read more

SiC Demand Growing Faster Than Supply


The silicon carbide (SiC) industry is in the midst of a major expansion campaign, but suppliers are struggling to meet potential demand for SiC power devices and wafers in the market. In just one example of the expansion efforts, Cree plans to invest up to $1 billion to increase its SiC fab and wafer capacities. As part of the plan, Cree is developing the world’s first 200mm (8-inch) SiC f... » read more

Week In Review: Manufacturing, Test


Chipmakers Cree posted its results for the third quarter of fiscal 2019 ended March 31. Revenue from continuing operations was $274 million, a 22% increase compared to revenue from continuing operations of $225 million in the like period a year ago. As previously announced, Cree executed a definitive agreement to sell its Lighting Products business to IDEAL. As a result, Cree’s Wolfspeed ... » read more

Electric Cars Gain Traction, But Challenges Remain


Battery-powered electric vehicles are expected to reach a milestone in terms of shipments in 2019, but the technology faces several significant hurdles to gain wider adoption in the market. Limited driving range, high costs, battery issues, and a spotty charging infrastructure are the main challenges for battery electric vehicles (BEVs). In addition, there are issues with various power semic... » read more

Week in Review: IoT, Security, Auto


Automotive Tech Marvell Technology Group opened its automotive electromagnetic compatibility lab in North America. The facility is CISPR 25-qualified and gives the chip company the capability to conduct in-house electrostatic discharge, emission, and immunity testing. Marvell also reported that its 88Q2112 offering received a mark of 100% in conformance testing outlined by the Japan Automotive... » read more

The Week in Review: IoT


Commentary Chris Voce of Forrester Research writes that the Internet of Things next year will move beyond experimentation in this piece. “At Forrester we believe IoT extends beyond devices and connectivity,” he writes. “But it's the business impact of IoT that truly defines what it is: the insights that you can derive with analytics and the business outcomes you can achieve.” M&A M... » read more

The Week In Review: Manufacturing


Packaging and test A*STAR’s Institute of Microelectronics (IME) has formed a fan-out wafer-level packaging consortium comprising of OSATs, materials vendors, equipment suppliers and others. The group is called the FOWLP Development Line Consortium. As part of the announcement, Singapore’s IME has established a development line to accelerate the development of fan-out. Located in IME’s... » read more

The Week in Review: IoT


Finance Farmobile has raised $18.1 million in a Series B round of funding, led by Anterra Capital and AmTrust Agricultural Insurance Services, bringing its total funding to more than $28 million. Existing investors also took part in the new round. The agricultural Internet of Things startup will use the money to expand its operations around the world. Farmobile provides agronomic and machine d... » read more

The Week In Review: IoT


Market Research There will be 8.4 billion connected things in use this year, a 31% gain from 2016, and leading up to 20.4 billion connected devices in 2020, according to Gartner. The market research firm estimates worldwide spending on endpoints and services will hit nearly $2 trillion in 2017. Greater China, North America, and Western Europe account for two-thirds of the IoT installed base th... » read more

Qualcomm + NXP = IoT Powerhouse


Coverage of the merger agreement between Qualcomm and NXP Semiconductors often focused on how the combination would yield the world’s largest supplier of chips for automotive electronics. Somewhat overlooked was its significance for the Internet of Things market. NXP CEO Rick Clemmer said in a statement, "The combination of Qualcomm and NXP will bring together all technologies required to... » read more

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