Rebalancing Test And Yield In IC Manufacturing


Balancing yield and test is essential to semiconductor manufacturing, but it's becoming harder to determine how much weight to give one versus the other as chips become more specialized for different applications. Yield focuses on maximizing the number of functional chips from a production batch, while test aims to ensure that each chip meets rigorous quality and performance standards. And w... » read more

The Chip Industry’s Next-Gen Roadmap


Todd Younkin, the new president and chief executive of the Semiconductor Research Corp. (SRC), sat down with Semiconductor Engineering to talk about engineering careers, R&D trends and what’s ahead for chip technologies over the next decade. What follows are excerpts of that conversation. SE: As a U.S.-based chip consortium, what is SRC's charter? Younkin: The Semiconductor Research... » read more

Manufacturing Bits: Sept. 29


Exploring chemical reactions using EUV The University of Tokyo has established a facility to study fast chemical reactions using a coherent extreme ultraviolet light source. The new coherent extreme ultraviolet (XUV) source facility enables researchers to explore time-dependent phenomena, such as ultrafast chemical reactions of biological or physical samples. Located in an underground fa... » read more

Manufacturing Bits: July 6


Luminosity record Japan’s High Energy Accelerator Research Organization (KEK) has regained the world’s record for the highest luminosity achieved in a particle accelerator, beating the previous mark by CERN. KEK achieved the record in the SuperKEKB, a giant storage ring that combines an electron-positron collider with an advanced detector. This system is designed to explore fundamental ... » read more

Making Autonomous Vehicles Safer


While self-driving vehicles are beta-tested on some public roads in real traffic situations, the semiconductor and automotive industries are still getting a grip on how to test and verify that vehicle electronics systems work as expected. Testing can be high stakes, especially when done in public. Some of the predictions about how humans will interact with autonomous vehicles (AVs) on public... » read more

Manufacturing Bits: Jan. 30


SRC’s new R&D centers The Semiconductor Research Corp. has launched a network of research centers within its recently-announced Joint University Microelectronics Program (JUMP). SRC officially launched the 5-year, $200 million program on Jan. 1. With various research centers, the mission of JUMP is to lay the groundwork that extends the viability of Moore’s Law through 2040. The idea is... » read more

System Bits: Sept. 20


Improving Torque Sensing In an advance that could bring new types of sensors and studies in quantum mechanics, Purdue University researchers have levitated a tiny nanodiamond particle with a laser in a vacuum chamber, using the technique for the first time to detect and measure its torsional vibration. The team said the experiment represents a nanoscale version of the torsion balance used i... » read more

Joint R&D Has Its Ups And Downs


As corporate spending on research and development dwindles, enterprises are reaching out to colleges and universities to supplement their R&D. And they often are finding eager partners in those endeavors, as professors and their graduate students look for help, financial and technical, in addressing long-term research projects. “Pure research is just a luxury no one can afford anymore,... » read more

Manufacturing Bits: April 12


Ink FETs The University of Pennsylvania has developed a new way to make chips by using nanocrystal inks. The devices, dubbed nanocrystal field-effect transistors (FETs), could be used one day to develop chips for flexible and wearable applications In the lab, researchers devised spherical nanoscale particles. These particles, which have electrical characteristics, were dispersed in a liquid... » read more

Internet of FD-SOI Things?


Are fully-depleted silicon-on-insulator (FD-SOI) wafers having a moment? Certainly SOI wafers are not new. Soitec’s SmartCut layer transfer technology was patented in 1994, and wafers with implanted oxide layers were available before that. Still, adoption of SOI wafers has been limited. Though they offer improved device isolation and reduced parasitics, the increased wafer cost has been an ob... » read more

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