Investors Back IoT Startups

By Jeff Dorsch - 07 Mar, 2018 - Comments: 0

Internet of Things startups took in more than $1.35 billion from corporate and private investors during the latter half of 2017, for a total of about $2.2 billion in the full year. Chicago-based Uptake Technologies, an Industrial IoT startup, had the biggest haul of the year, with $117 million raised in a Series D round, on top of a $90 million Series C round earlier in 2017, bringing its to... » read more

Executive Insight: Wally Rhines (March 2018)

By Brian Bailey - 01 Mar, 2018 - Comments: 0

Wally Rhines, president and CEO of [getentity id="22017" e_name="Mentor, a Siemens Business"], sat down with Semiconductor Engineering to discuss a wide range of industry and technology changes and how that will play out over the next few years. What follows are excerpts of that conversation. SE: What will happen in the end markets? Rhines: The end markets are perhaps more exciting from a... » read more

The Week In Review: Design

By Jesse Allen - 16 Feb, 2018 - Comments: 0

Tools & IP Arm unveiled a new suite of IP focused on machine learning for edge devices. Currently dubbed Project Trillium, it includes the Arm ML processor, the second-generation Arm Object Detection (OD) processor, and open-source Arm NN software. The ML processor provides more than 4.6 TOPs in mobile environments with efficiency of 3 TOPs/W. People detection is a focus of the OD processo... » read more

Predictions: Methodologies And Tools

By Brian Bailey - 25 Jan, 2018 - Comments: 0

Predictions are divided into four posts this year. Part one covered markets and drivers. The second part looked at manufacturing, devices and companies and this part will cover methodologies and tools. In addition, the outlook from EDA executives will be provided in a separate post. Intellectual property As designs get larger, it should be no surprise that the size of the [getkc id="43" kc_... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 29 Dec, 2017 - Comments: 0

Chipmakers Christopher Rolland, an analyst at Susquehanna International, expects to see more merger and acquisition activity in the IC industry heading into 2018. “M&A activity slowed in 2017, but the year is going out with a bang!” Rolland said in a recent research note. Towards the end of 2017, for example, Broadcom made a bid for Qualcomm, while Marvell announced intent to buy Cavium. ... » read more

HPC Case Study: CFD Applications On ARM

By Arm - 20 Dec, 2017 - Comments: 0

In this paper, we examine the readiness and potential of ARM-based platforms for High Performance Computing, and have benchmarked two different computational fluid dynamics (CFD) applications. CFD represents one of the most widely used HPC applications in aerospace, automotive and other engineering areas such as turbine-design. For server hardware, we leverage the ThunderX platform from Cavium,... » read more

Power/Performance Bits: Dec. 5

By Jesse Allen - 05 Dec, 2017 - Comments: 0

Solar jet fuel Researchers at ETH Zurich demonstrated the ability to use solar energy to create the precursor to jet fuel from water and carbon dioxide, a process that could lead to carbon-neutral air travel. The scientists performed 295 consecutive cycles in a 4 kW solar reactor, yielding 700 standard liters of hydrogen and carbon monoxide (syngas), the precursor to kerosene and other liqu... » read more

The Week in Review: IoT

By Jeff Dorsch - 22 Nov, 2017 - Comments: 0

Commentary Chris Voce of Forrester Research writes that the Internet of Things next year will move beyond experimentation in this piece. “At Forrester we believe IoT extends beyond devices and connectivity,” he writes. “But it's the business impact of IoT that truly defines what it is: the insights that you can derive with analytics and the business outcomes you can achieve.” M&A M... » read more

Deals: Mentor-Solido, Marvell-Cavium

By Ed Sperling - 20 Nov, 2017 - Comments: 0

Marvell today signed a definitive agreement to buy Cavium for roughly $6 billion, ending weeks of speculation about whether the deal would go through. And Mentor, a Siemens business, paid an undisclosed price to buy Solido Design Automation, which tracks variation in complex designs. Both deals are part of a new flurry of M&A activity across the semiconductor industry as the industry ret... » read more

The Week in Review: IoT

By Jeff Dorsch - 10 Nov, 2017 - Comments: 0

Security Mocana said it is working with Avnet, Infineon Technologies, Microsoft, and Xilinx to provide Industrial Internet of Things systems that meet cybersecurity standards. The systems utilize the Avnet UltraZed-EG system-on-module, Mocana’s security software running on the Xilinx Zynq Ultrascale+ MPSoc, and Infineon’s OPTIGA Trusted Platform Module 2.0 security chip. The Microsoft Azur... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Cavium

Investors Back IoT Startups

Executive Insight: Wally Rhines (March 2018)

The Week In Review: Design

Predictions: Methodologies And Tools

The Week In Review: Manufacturing

HPC Case Study: CFD Applications On ARM

Power/Performance Bits: Dec. 5

The Week in Review: IoT

Deals: Mentor-Solido, Marvell-Cavium

The Week in Review: IoT