Gaps In Metrology Could Impact Yield

By Mark LaPedus - 17 Apr, 2014 - Comments: 0

For some time, chipmakers have been developing new and complex chip architectures, such as 3D NAND, finFETs and stacked die. But manufacturing these types of chips is no simple task. It requires a robust fab flow to enable new IC designs with good yields. In fact, yield is becoming a more critical part of the flow. Yield is a broad term that means different things to different parts of the ... » read more

Challenges Mount In Inspection And Metrology

By Mark LaPedus - 12 Dec, 2013 - Comments: 0

Chipmakers are moving full speed ahead toward smaller process nodes, thereby driving up the costs and complexities in chip manufacturing. The migrations also are putting enormous stress on nearly all points of the fab flow, including a critical but unsung part of the business—process control. Process control involves 20 or so different segments in the inspection and metrology arena. Genera... » read more

Wanted: New Metrology Funding Models

By Mark LaPedus - 21 Mar, 2013 - Comments: 0

By Mark LaPedus The shift toward the 20nm node and beyond will require new and major breakthroughs in chip manufacturing. Most of the attention centers around lithography, gate stacks, interconnects, strain engineering and design-for-manufacturing (DFM). Lost in the conversation are two other critical but overlooked pieces in the manufacturing puzzle—wafer inspection and metrology. ... » read more

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Gaps In Metrology Could Impact Yield

Challenges Mount In Inspection And Metrology

Wanted: New Metrology Funding Models