Week In Review: Design, Low Power

By Jesse Allen - 13 Mar, 2020 - Comments: 0

Tools & IP Synopsys revealed DSO.ai (Design Space Optimization AI), an autonomous AI application that searches for optimization targets in very large solution spaces of chip design, inspired by the process of DeepMind's game-playing AlphaZero. DSO.ai engines ingest large data streams generated by chip design tools and use them to explore search spaces, observing how a design evolves over t... » read more

Manufacturing Bits: Jan. 7

By Mark LaPedus - 07 Jan, 2020 - Comments: 0

Beyond 5G chips At the recent IEEE International Electron Devices Meeting (IEDM), NTT and the Tokyo Institute of Technology presented a paper on a technology that could enable high-speed wireless devices beyond the 5G standard. Researchers have devised a 300GHz wireless transceiver (TRx) that supports a data rate of more than 100Gb/s. The device is based on a technology called indium phosph... » read more

Manufacturing Bits: Dec. 16

By Mark LaPedus - 16 Dec, 2019 - Comments: 0

Imec-Leti alliance At the recent IEEE International Electron Devices Meeting (IEDM), Imec and Leti announced plans to collaborate in select areas. The two R&D organizations plan to collaborate in two areas—artificial intelligence (AI) and quantum computing. Imec and Leti have been separately working on AI technologies based on various next-generation memory architectures. Both entitie... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 22 Nov, 2019 - Comments: 0

Chipmakers For some time, Intel has experienced supply constraints and shortages for its 14nm chip products. Apparently, the company is still having issues with both 14nm and 10nm. “Despite our best efforts, we have not yet resolved this challenge,” according to a statement from Michelle Johnston Holthaus, executive vice president and general manager of the Sales, Marketing and Communicati... » read more

Blog Review: May 8

By Jesse Allen - 08 May, 2019 - Comments: 0

Synopsys' Taylor Armerding warns that the threat of cyber war on the financial system is a real possibility and points to four major vulnerability concerns. Cadence's Meera Collier takes a look at bees and technology, from smart hives to sensors that can be carried on the insects' backs. Mentor's Brent Klingforth argues that electrical and mechanic designers need to seamlessly share infor... » read more

MRAM: from STT to SOT, for security and memory

By Technical Paper Link - 30 Apr, 2019 - Comments: 0

Abstract: "Spin Transfer Torque Magnetic Random Access Memory (STT-MRAM) is one of the leading candidates for embedded memory convergence in advanced technology nodes. It is particularly adapted to low-power applications, requiring a decent level of performance. However, it also have interests for secured applications. The PRESENT cipher is a lightweight cryptographic algorithm targeting ultra... » read more

Power/Performance Bits: Feb. 26

By Jesse Allen - 26 Feb, 2019 - Comments: 0

Integrated RRAM for edge AI Researchers at CEA-Leti and Stanford University have developed the first circuit integrating multiple-bit non-volatile Resistive RAM (RRAM) with silicon computing units, as well as new memory resiliency features that provide 2.3-times the capacity of existing RRAM. The proof-of-concept chip monolithically integrates two heterogeneous technologies: 18KB of on-chip... » read more

Manufacturing Bits: Jan. 2

By Mark LaPedus - 02 Jan, 2019 - Comments: 0

Better nanowire MOSFETs At the recent IEEE International Electron Devices Meeting (IEDM), Imec and Applied Materials presented a paper on a new and improved way to fabricate vertically stacked gate-all-around MOSFETs. More specifically, Imec and Applied reported on process improvements for a silicon nanowire MOSFET, which is integrated in a CMOS dual work function metal replacement metal ga... » read more

Manufacturing Bits: Nov. 27

By Mark LaPedus - 27 Nov, 2018 - Comments: 0

New kilogram definition After years of debate and scientific work, a group of delegates from 60 countries have voted to redefine four key unit measurements—the kilogram, electric current (ampere), temperature (kelvin), and the amount of substance (mole). The vote took place at the recent 26th General Conference of Weights and Measures. Hosted by the International Bureau of Weights and Mea... » read more

Practical Methods To Overcome The Challenges Of 3D Logic Design

By Benjamin Vincent - 25 Jun, 2018 - Comments: 0

What should you do If you don’t have enough room on your floor to store all your old boxes? Luckily, we live in a 3D world, and you can start stacking them on top of each other. The Challenge: How can we shrink logic devices? Logic designers are currently facing even bigger challenges than you might be having in tidying up your storage area. Not only are logic cells highly packed together... » read more

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tag: CEA-Leti

Week In Review: Design, Low Power

Manufacturing Bits: Jan. 7

Manufacturing Bits: Dec. 16

Week In Review: Manufacturing, Test

Blog Review: May 8

MRAM: from STT to SOT, for security and memory

Power/Performance Bits: Feb. 26

Manufacturing Bits: Jan. 2

Manufacturing Bits: Nov. 27

Practical Methods To Overcome The Challenges Of 3D Logic Design

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