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TAP-2.5D: A Thermally-Aware Chiplet Placement Methodology for 2.5D Systems


Abstract "Heterogeneous systems are commonly used today to sustain the historic benefits we have achieved through technology scaling. 2.5D integration technology provides a cost-effective solution for designing heterogeneous systems. The traditional physical design of a 2.5D heterogeneous system closely packs the chiplets to minimize wirelength, but this leads to a thermally-inefficient design... » read more

Chiplet-Based Advanced Packaging Technology from 3D/TSV to FOWLP/FHE


T. Fukushima, "Chiplet-Based Advanced Packaging Technology from 3D/TSV to FOWLP/FHE," 2021 Symposium on VLSI Circuits, 2021, pp. 1-2, doi: 10.23919/VLSICircuits52068.2021.9492335. Abstract: "More recently, "chiplets" are expected for further scaling the performance of LSI systems. However, system integration with the chiplets is not a new methodology. The basic concept dates back well over ... » read more

Current And Future Packaging Trends


Semiconductor Engineering sat down to discuss IC packaging technology trends and other topics with William Chen, a fellow at ASE; Michael Kelly, vice president of advanced packaging development and integration at Amkor; Richard Otte, president and CEO of Promex, the parent company of QP Technologies; Michael Liu, senior director of global technical marketing at JCET; and Thomas Uhrmann, directo... » read more

Chipmakers Getting Serious About Integrated Photonics


Integrating photonics into semiconductors is gaining traction, particularly in heterogeneous multi-die packages, as chipmakers search for new ways to overcome power limitations and deal with increasing volumes of data. Power has been a growing concern since the end of Dennard scaling, which happened somewhere around the 90nm node. There are more transistors per mm², and the wires are thinne... » read more

NN-Baton: DNN Workload Orchestration & Chiplet Granularity Exploration for Multichip Accelerators


"Abstract—The revolution of machine learning poses an unprecedented demand for computation resources, urging more transistors on a single monolithic chip, which is not sustainable in the Post-Moore era. The multichip integration with small functional dies, called chiplets, can reduce the manufacturing cost, improve the fabrication yield, and achieve die-level reuse for different system scales... » read more