Chip Industry Week In Review

By The SE Staff - 31 May, 2024 - Comments: 0

JEDEC and the Open Compute Project rolled out a new set of guidelines for standardizing chiplet characterization details, such as thermal properties, physical and mechanical requirements, and behavior specs. Those details have been a sticking point for commercial chiplets, because without them it's not possible to choose the best chiplet for a particular application or workload. The guidelines ... » read more

Will Chiplet Adoption Mimic IP Adoption?

By Alphawave Semi - 29 May, 2024 - Comments: 0

If we look at the semiconductor industry expansion during the last 25 years, adoption of design IP in every application appears to be one of the major factors of success, with silicon technology incredible development by a x100 factor, from 250nm in 2018 to 3nm (if not 2nm) in 2023. We foresee the move to chiplet-based architecture to soon play the same role that SoC chip-based architecture and... » read more

Considerations to Successfully Integrate Chiplets in Designs

By Keysight - 29 May, 2024 - Comments: 0

Chiplet integration is a promising approach to creating heterogeneous and complex system-on-chips (SoCs) with significant performance, power, scalability, flexibility, and cost benefits. However, chiplet integration also poses substantial design, verification, testing, and packaging challenges, requiring new standards and design methodologies. Electronic design automation (EDA) software and sim... » read more

Scheduling Multi-Model AI Workloads On Heterogeneous MCM Accelerators (UC Irvine)

By Technical Paper Link - 24 May, 2024 - Comments: 0

A technical paper titled “SCAR: Scheduling Multi-Model AI Workloads on Heterogeneous Multi-Chiplet Module Accelerators” was published by researchers at University of California Irvine. Abstract: "Emerging multi-model workloads with heavy models like recent large language models significantly increased the compute and memory demands on hardware. To address such increasing demands, designin... » read more

Integration Hurdles For Analog And RF In Next-Gen Packages

By Gregory Haley - 23 May, 2024 - Comments: 0

A rapid increase in wireless connectivity and more sensors, coupled with a shift away from monolithic SoCs toward heterogeneous integration, is driving up the amount of analog/RF content in systems and changing the dynamics within a package. Since the early 2000s, the majority of chips used at the most advanced nodes were systems-on-chip (SoCs). All features had to fit into a single planar S... » read more

Compilation Challenges Of Scaling Up Quantum Computing With Superconducting Chiplet Architecture

By Technical Paper Link - 21 May, 2024 - Comments: 0

A technical paper titled “MECH: Multi-Entry Communication Highway for Superconducting Quantum Chiplets” was published by researchers at University of California San Diego, University of California Santa Barbara, and Cisco Quantum Lab. Abstract: "Chiplet architecture is an emerging architecture for quantum computing that could significantly increase qubit resources with its great scalabili... » read more

Will Domain-Specific ICs Become Ubiquitous?

By Brian Bailey - 16 May, 2024 - Comments: 0

Questions are surfacing for all types of design, ranging from small microcontrollers to leading-edge chips, over whether domain-specific design will become ubiquitous, or whether it will fall into the historic pattern of customization first, followed by lower-cost, general-purpose components. Custom hardware always has been a double-edged sword. It can provide a competitive edge for chipmake... » read more

SRAM Security Concerns Grow

By Karen Heyman - 09 May, 2024 - Comments: 0

SRAM security concerns are intensifying as a combination of new and existing techniques allow hackers to tap into data for longer periods of time after a device is powered down. This is particularly alarming as the leading edge of design shifts from planar SoCs to heterogeneous systems in package, such as those used in AI or edge processing, where chiplets frequently have their own memory hi... » read more

Overcoming Chiplet Integration Challenges With Adaptability

By Jayson Bethurem - 09 May, 2024 - Comments: 0

Chiplets are exploding in popularity due to key benefits such as lower cost, lower power, higher performance and greater flexibility to meet specific market requirements. More importantly, chiplets can reduce time-to-market, thus decreasing time-to-revenue! Heterogeneous and modular SoC design can accelerate innovation and adaptation for many companies. What’s not to like about chiplets? Well... » read more

UCIe And Automotive Electronics: Pioneering The Chiplet Revolution

By Vinod Khera - 09 May, 2024 - Comments: 0

The automotive industry stands at the brink of a profound transformation fueled by the relentless march of technological innovation. Gone are the days of the traditional, one-size-fits-all system-on-chip (SoC) design framework. Today, we are witnessing a paradigm shift towards a more modular approach that utilizes diverse chiplets, each optimized for specific functionalities. This evolution pro... » read more

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