Chip Industry Week In Review

By The SE Staff - 16 Feb, 2024 - Comments: 0

By Susan Rambo, Karen Heyman, and Liz Allan. Renesas plans to acquire Altium, maker of PCB design software, for $5.9 billion. In a conference call, Renesas CEO Hidetoshi Shibata cited Altium's PCB design software and digital twin virtual modeling as key components of its future strategy. "I believe it will generate transformational value for our combined customers and our stakeholders," Shib... » read more

Week in Review – IoT, Security, Autos

By Jeff Dorsch - 11 Oct, 2019 - Comments: 0

Products/Services Arm TechCon got under way with a series of announcements. Arm is a founding member of the Autonomous Vehicle Computing Consortium, along with General Motors, Toyota Motor, DENSO, Continental, Bosch, NXP Semiconductors, and Nvidia. More information on the consortium is available here. “Imagine a world where vehicles are able to perceive their dynamically changing environment... » read more

Week in Review: IoT, Security, Autos

By Jeff Dorsch - 16 Aug, 2019 - Comments: 0

Products/Services Arm released a survey of 650 industry representatives about eSIM and iSIM technology. Ninety percent of the respondents were aware of eSIM, while 43% were unaware of iSIM. Vincent Korstanje, vice president and general manager, Emerging Businesses at Arm, cites the leading three obstacles to large commercial deployments: Resistance from traditional stakeholders (69% of respond... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 05 Apr, 2019 - Comments: 0

Internet of Things Microsoft has new services and capabilities for Azure-connected Internet of Things devices. There’s a new IoT security tool called Azure Security Center for IoT, which ties in with other tools within Azure IoT Hub. Azure Security Center for IoT uses Azure Security Center, Microsoft’s threat intelligence offering. The new IoT security tool also hooks into Azure Sentinel, ... » read more

Explosive Growth Ahead

By Ed Sperling - 27 Jul, 2017 - Comments: 1

Over the next five years, sales across the semiconductor supply chain will double from $2 trillion to $4 trillion, said Ajit Manocha, president and CEO of SEMI, during the opening presentation at Semicon West this month. These are gigantic numbers, and they reflect some massive shifts now underway across the semiconductor industry. Many chipmakers have been trying to figure out the next big ... » read more

Will 5G Enable Connected Cars?

By Ann Mutschler - 03 Nov, 2016 - Comments: 1

As the telecom, automotive and semiconductor ecosystems rally to develop solutions for next-generation mobile networks for the connected car, 5G technology has emerged as a strong contender. Fifth-generation mobile networks will enable data transmission rates of more than 10Gps, connecting machines to machines, as well as everything else, including smartphones, IoT devices that require a... » read more

Week 21 – Visiting Detroit

By Anne Cirkel - 31 Oct, 2014 - Comments: 1

Who would have thought I’d end up sitting outside in the sunshine in downtown Detroit writing the first draft for my next blog. I’m here with a few of my Mentor colleagues to attend SAE Convergence and to have a discussion with GM about a possible DAC keynote. Stay tuned (and keep your fingers crossed) — I hope to tell you more about that at a later time. SAE Convergence is a two-day conf... » read more

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Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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Chip Industry Week In Review

Week in Review – IoT, Security, Autos

Week in Review: IoT, Security, Autos

Week in Review: IoT, Security, Auto

Explosive Growth Ahead

Will 5G Enable Connected Cars?

Week 21 – Visiting Detroit

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