tag: Cisco

Week In Review: Manufacturing, Test
By Mark LaPedus - 06 Mar, 2020 - Comments: 0

Fab tools, materials and packaging Intel has recognized 37 companies for its annual suppliers’ awards. The list includes equipment, materials, packaging houses and other segments. These suppliers have collaborated with Intel to implement process improvements with good products and services. See who made the list here. ---------------------------------------- Lam Research has introduced... » read more

New Architectural Issues Facing Auto Ecosystem
By Ann Mutschler - 05 Mar, 2020 - Comments: 0

As chips bound for the automotive world move to small process nodes, including 5nm and below, the automotive ecosystem is wrestling with both scaling issues and challenges related to architecting safety-critical systems using fewer chips. This may sound counterintuitive, because one of the main reasons automotive chip providers are moving to smaller nodes is to reduce the number of chips in ... » read more

How AI In Edge Computing Drives 5G And The IoT
By Ron Lowman - 13 Feb, 2020 - Comments: 0

Edge computing, which is the concept of processing and analyzing data in servers closer to the applications they serve, is growing in popularity and opening new markets for established telecom providers, semiconductor startups, and new software ecosystems. It’s brilliant how technology has come together over the last several decades to enable this new space starting with Big Data and the idea... » read more

The Evolution Of Pervasive Computing
By Ed Sperling - 09 Jan, 2020 - Comments: 0

The computing world has gone full circle toward pervasive computing. In fact, it has done so more than once, which from the outside may look like a more rapid spin cycle than a real change of direction. Dig deeper, though, and it's apparent that some fundamental changes are at work. This genesis of pervasive computing dates back to the introduction of the PC in 1981, prior to which all corpo... » read more

What’s Next For High Bandwidth Memory
By Mark LaPedus - 17 Dec, 2019 - Comments: 1

A surge in data is driving the need for new IC package types with more and faster memory in high-end systems. But there are a multitude of challenges on the memory, packaging and other fronts. In systems, for example, data moves back and forth between the processor and DRAM, which is the main memory for most chips. But at times this exchange causes latency and power consumption, sometimes re... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 13 Dec, 2019 - Comments: 0

Chipmakers and OEMs TrendForce has released its projected foundry rankings for the fourth quarter of 2019. TSMC remains in first place, followed by Samsung, GlobalFoundries and UMC, according to the firm. “TrendForce projects the foundry industry’s 4Q19 revenue performance to exceed previous expectations,” according to the firm. “Nonetheless, the ongoing U.S-China trade war and uncerta... » read more

CEO Outlook: Rising Costs, Chiplets, And A Trade War
By Ed Sperling - 26 Jun, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss what's changing across the semiconductor industry with Wally Rhines, CEO emeritus at Mentor, a Siemens Business; Jack Harding, president and CEO of eSilicon; John Kibarian, president and CEO of PDF Solutions; and John Chong, vice president of product and business development for Kionix. What follows are excerpts of that discussion, which was held in... » read more

Test Moving Forward And Backward
By Ed Sperling - 11 Jun, 2019 - Comments: 0

Test, once considered an important but rather mundane way of separating good chips from the not-so-good and the total rejects, is taking on a whole new life. After decades of largely living in the shadows behind design and advancements in materials and lithography, test has quietly shifted into a much more critical and more public role. But it has taken several rather significant shifts acro... » read more

Data Confusion At The Edge
By Ed Sperling - 11 Jun, 2019 - Comments: 0

Disparities in pre-processing of data at the edge, coupled with a total lack of standardization, are raising questions about how that data will be prioritized and managed in AI and machine learning systems. Initially, the idea was that 5G would connect edge data to the cloud, where massive server farms would infer patterns from that data and send it back to the edge devices. But there is far... » read more

Adding Order And Structure To Verification
By Brian Bailey - 30 May, 2019 - Comments: 0

You can't improve what you can't measure, and when it comes to methodologies the notion of measurement becomes more difficult. Add in notions of the skills, capabilities and experience levels of individuals within an organization, which may affect their ability to adopt certain technologies, and it requires considerable attention. This is where concepts such as capability maturity models (CM... » read more

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