tag: City University of Hong Kong

Power/Performance Bits: July 28

By Jesse Allen - 28 Jul, 2020 - Comments: 0

Programmable photonics Researchers from the University of Southampton developed a method for making programmable integrated switching units on a silicon photonics chip. By using a generic optical circuit that can be fabricated in bulk then later programmed for specific applications, the team hopes to reduce production costs. "Silicon photonics is capable of integrating optical devices and... » read more

Manufacturing Bits: June 12

By Mark LaPedus - 12 Jun, 2018 - Comments: 0

Elastic diamonds A group has developed a way to make elastic diamonds, enabling tiny diamond needles that can flex and stretch. Ulsan National Institute of Science and Technology (UNIST), the Massachusetts Institute of Technology (MIT), the City University of Hong Kong and Nanyang Technological University have developed a process that enables elastic diamonds. Elastic diamonds could one day... » read more

Newer posts →

Trending Articles

Hybrid Bonding Makes Strides Toward Manufacturability

Companies are selecting preferred flows, but the process details are changing rapidly to meet the needs of different applications.

by Laura Peters

Americas Chip Funding Energizes Industry

Massive government infusions aim to improve security and supply chain robustness.

Advanced Packaging Driving New Collaboration Across Supply Chain

Rising complexity is changing the way companies engage and interact, but long-standing barriers in communication, culture, and IP protection are slowing progress.

by Gregory Haley

Chiplets Make Progress Using Interconnects As Glue

Industry learning expands as more SoCs are disaggregated at leading edge, opening door to more third-party chiplets.

by Ann Mutschler

2D Semiconductors Make Progress, But So Does Silicon

Can 2D materials be fabricated consistently at a cost that competes with silicon?

by Katherine Derbyshire

Knowledge Centers
Entities, people and technologies explored

Related Articles

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

GDDR7 Memory Supercharges AI Inference

High bandwidth and low latency are paramount for AI-powered edge and endpoints.

by Tim Messegee

CPU Performance Bottlenecks Limit Parallel Processing Speedups

Hardware optimizations and well-thought-out software architectures can help, but only incrementally.

by Bryon Moyer

Fantastical Creatures

Why HLS is critical for determining which type of processors to use.

by Russell Klein

Is PPA Relevant Today?

Power, performance, and area/cost have been the three optimization targets for decades, but are they pertinent for today's complex systems?

by Brian Bailey

Power Delivery Challenged By Data Center Architectures

More powerful servers are required to crunch more data, but getting power to those servers is becoming complicated.

by Ann Mutschler

CXL Thriving As Memory Link

Adoption of Compute Express Link protocol spreads as way to connect memories.

by Karen Heyman

Higher Density, More Data Create New Bottlenecks In AI Chips

More options are available, but each comes with tradeoffs and adds to complexity.

by Adam Kovac

About

Navigation

Connect With Us

Facebook
Twitter @semiEngineering
LinkedIn
YouTube

Copyright ©2013-2024 SMG | Terms of Service | Privacy Policy