Auto Displays: Bigger, Brighter, More Numerous

By Ann Mutschler - 05 Aug, 2021 - Comments: 0

Displays are rapidly becoming more critical to the central brains in automobiles, accelerating the adoption and evolution of this technology to handle multiple types of audio, visual, and other data traffic coming into and flowing throughout the vehicle. These changes are having a broad impact on the entire design-through-manufacturing flow for display chip architectures. In the past, these ... » read more

The Good And Bad Of Auto IC Updates

By John Koon - 03 Jun, 2021 - Comments: 0

Keeping automobiles updated enough to avoid problems is becoming increasingly difficult as more complex electronics are added into vehicles, and as the lifetimes of those devices are extended to a decade or more. Modern vehicles are full of electronics. In fact, the value of electronic devices used in modern vehicles is expected to double in the next 10 years, growing to $469 billion by 2030... » read more

Maximize The Value Of Your 3rd Party IP Investment

By Srinath Anantharaman - 18 May, 2021 - Comments: 0

The need to get to market sooner has resulted in significant growth in the use of 3rd party IP. This in turn has led to a growth in IP vendors. While licensing 3rd party IP may lead to reducing the development effort and time, it can potentially be costly and bring upon significant risk. Of course, there is the obvious cost of licensing the IP itself, but there are several other hidden costs... » read more

Steep Spike For Chip Complexity And Unknowns

By Ed Sperling - 05 May, 2021 - Comments: 0

Cramming more and different kinds of processors and memories onto a die or into a package is causing the number of unknowns and the complexity of those designs to skyrocket. There are good reasons for combining all of these different devices into an SoC or advanced package. They increase functionality and can offer big improvements in performance and power that are no longer available just b... » read more

New Uses For AI

By Ed Sperling - 01 Apr, 2021 - Comments: 0

AI is being embedded into an increasing number of technologies that are commonly found inside most chips, and initial results show dramatic improvements in both power and performance. Unlike high-profile AI implementations, such as self-driving cars or natural language processing, much of this work flies well under the radar for most people. It generally takes the path of least disruption, b... » read more

Using Cliosoft SOS Design Management Platform In The Cloud

By Cliosoft - 31 Mar, 2021 - Comments: 0

In this eBook, we will talk about the various scenarios for how designers can leverage Cliosoft’s SoC design management platform in the cloud (Amazon Web Services and Google Cloud Platform) to successfully tapeout their SoCs. Click here to access the eBook. » read more

Challenges Of Using The Cloud For IC Design

By Srinath Anantharaman - 04 Mar, 2021 - Comments: 0

The ‘cloud’ is so ubiquitous that perhaps even your grandmother has heard about it. There are advertisements on TV with various vendors touting their cloud offerings. The cloud is ideal for eCommerce and SaaS (Software as a Service) offerings, as the elasticity on demand provides a convenient way to scale up when demand is high and scale down when it is low. Yet the design community has ... » read more

Security Provisioning Moves Out Of The Factory

By Bryon Moyer - 04 Mar, 2021 - Comments: 1

Security credentials traditionally have been provisioned during chip manufacturing, often as a final part of the testing process. That's starting to change. Logistics management can be improved by pushing that process out — even as far as the on-boarding process. And simpler on-boarding can hide most of the details from the user. “The IT approach to provisioning IoT devices has primar... » read more

Longer Chip Lifecycles Increase Security Threat

By Ed Sperling - 04 Feb, 2021 - Comments: 0

The longer chips and electronic systems remain in use, the more they will need to be refreshed with software and firmware updates. That creates a whole new level of security risks, ranging from over-the-air intercepts to compromised supply chains. These problems have been escalating as more devices are connected to the Internet and to each other, but it's particularly worrisome when it invol... » read more

Managing Device Certificates Is Becoming Harder

By Bryon Moyer - 07 Jan, 2021 - Comments: 0

As the number of devices connected to the Internet balloons, certificate management is becoming more complex, more essential, and significantly harder to keep track of. There are many different certificates for many different purposes, not to mention certificates that are unique to each device. And the lifetimes of those certificates may vary, making it even tougher to keep operating certifi... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?