tag: cloud

Assuring Reliable Processor Performance At Scale
By Uzi Baruch - 08 Mar, 2022 - Comments: 0

In today’s data center environment, resilience is key. Cloud providers are built on as-a-service business models, where uptime is critical to ensure their customers’ business continuity. Reputation and competitiveness require service at extremely high performance, low power, and increasing functionality, with zero tolerance for unplanned downtime or errors. If you’re a hyperscaler, o... » read more

Open RAN Direct RF Sampling Radio Transceiver Architectures For Massive MIMO
By AMD - 02 Mar, 2022 - Comments: 0

With the exponential increase in wireless traffic, mobile networks are transformed into more software-driven, virtualized, flexible, intelligent, and energy efficient systems. These trends have stimulated significant change in the core network with the advent of software defined networks (SDN) and network functions virtualization (NFV), which have enabled building more agile and less expensive ... » read more

Building Multipurpose Systems With Dynamic Function Exchange Part Two: Bundling And Managing Resources
By Ed Rebello - 03 Feb, 2022 - Comments: 0

In our previous article, we mentioned that one of the most-common oversights that designers can make is to not fully use available system resources, and we introduced you to the concept of Dynamic Function Exchange (DFX), a design approach that dynamically reallocates unused system resources to other tasks. From a technical standpoint, implementing DFX is relatively straightforward using a c... » read more

EDA In The Cloud Is Driving Semiconductor Innovation
By Nebabie Kebebew - 22 Dec, 2021 - Comments: 0

In the past decade, the move towards cloud computing occurred primarily in sectors like finance, retail, and healthcare, with the emergence of leading public cloud vendors such as Amazon Web Services (AWS), Microsoft Azure, Google Cloud Platform, and others accelerating the trend. However, the chip design industry has been slower to adopt cloud computing. In the current highly competitive en... » read more

Next Steps For Panel-Level Packaging
By Mark LaPedus - 20 Dec, 2021 - Comments: 1

Tanja Braun, group manager at Fraunhofer Institute for Reliability and Microintegration (IZM), sat down with Semiconductor Engineering to talk about III-V device packaging, chiplets, fan-out and panel-level processing. Fraunhofer IZM recently announced a new phase of its panel-level packaging consortium. What follows are excerpts of that discussion. SE: IC packaging isn’t new, but years a... » read more

Enablers And Barriers For Connecting Diverse Data
By Anne Meixner - 09 Nov, 2021 - Comments: 0

More data is being collected at every step of the manufacturing process, raising the possibility of combining data in new ways to solve engineering problems. But this is far from simple, and combining results is not always possible. The semiconductor industry’s thirst for data has created oceans of it from the manufacturing process. In addition, semiconductor designs large and small now ha... » read more

Easier And Faster Ways To Train AI
By Bryon Moyer - 04 Nov, 2021 - Comments: 0

Training an AI model takes an extraordinary amount of effort and data. Leveraging existing training can save time and money, accelerating the release of new products that use the model. But there are a few ways this can be done, most notably through transfer and incremental learning, and each of them has its applications and tradeoffs. Transfer learning and incremental learning both take pre... » read more

Using ML In EDA
By Ed Sperling - 20 Sep, 2021 - Comments: 0

Machine learning is becoming essential for designing chips due to the growing volume of data stemming from increasing density and complexity. Nick Ni, director of product marketing for AI at Xilinx, examines why machine learning is gaining traction at advanced nodes, where it’s being used today and how it will be used in the future, how quality of results compare with and without ML, and what... » read more

Tradeoffs Between Edge Vs. Cloud
By Brian Bailey - 09 Sep, 2021 - Comments: 0

Increasing amounts of processing are being done on the edge, but how the balance will change between what's computed in the cloud versus the edge remains unclear. The answer may depend as much on the value of data and other commercial reasons as on technical limitations. The pendulum has been swinging between doing all processing in the cloud to doing increasing amounts of processing at the ... » read more

Best Practices For Deploying Cliosoft SOS On AWS
By Cliosoft - 01 Sep, 2021 - Comments: 0

Semiconductor Integrated Circuits (ICs) are at the center of a number of modern technological innovations. To keep up with the ever-increasing pace of innovation, IC design teams require robust, scalable design management (DM) solutions to enable seamless global collaboration and increase productivity. This eBook outlines the advantages of, and best practices, for deploying Cliosoft SOS design ... » read more

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