tag: CMOS

Keeping The Whole Package Cool
By Katherine Derbyshire - 12 May, 2016 - Comments: 0

Heat dissipation is a critical issue for designers of complex chip-stacking and system-in-package devices. The amount of heat generated by a device increases as the number of transistors goes up, but the ability to dissipate the heat depends on the package surface area. Because the goal of 3D packaging is to squeeze more transistors into less overall space, new heat dissipation issues are em... » read more

The Future Of MEMS Sensor Design And Manufacturing
By Stephen Breit - 21 Apr, 2016 - Comments: 0

I recently gave an invited talk at the IEEE Inertial Sensors 2016 symposium that discussed the future of commodity MEMS inertial sensor design and manufacturing. Inertial sensors comprise one of the fastest growing and most successful segments of the MEMS market. There are three industry trends that I believe will have major implications for motion sensor design and manufacturing and, more g... » read more

Flexible Sensors Begin Ramping
By Jeff Dorsch - 07 Apr, 2016 - Comments: 0

Sensors are at the heart of the [getkc id="76" comment="Internet of Things"]. Flexible sensors promise to extend the Internet of Everything to the battlefield, the gymnasium, the hospital, and many other places. Flexible [getkc id="187" kc_name="sensors"] represent the forefront of a sea of change in electronics, marking the transition from rigid semiconductors made with silicon and other ha... » read more

The Economics Of Moore’s Law
By Imec - 18 Feb, 2016 - Comments: 0

By Marc Heyns I’m very optimistic about the continuation of Moore’s Law. But in saying that, I’m speaking about Moore’s Law purely as an economic law. I believe we’ll be able to offer increasing amounts of functionality at lower and lower costs. And technological innovations as well as advances in design and application will be crucial in realizing this. But I don’t believe a ne... » read more

What Comes Next
By Imec - 19 Nov, 2015 - Comments: 0

By Marc Heyns I’m very optimistic about the continuation of Moore’s Law. But in saying that, I’m speaking about Moore’s Law purely as an economic law. I believe we’ll be able to offer increasing amounts of functionality at lower and lower costs. And technological innovations as well as advances in design and application will be crucial in realizing this. But I don’t believe a ... » read more

Making Cars Smarter
By Ann Mutschler - 05 Nov, 2015 - Comments: 1

The fuel injection control unit has come a long way since 1983 when Ford Motor Co. first included a 16-bit Intel microcontroller-based fuel injection system in its 4-cylinder Escort. Today, some high end vehicles contain more than 100 microprocessors, which is mind boggling in comparison to that Escort that contained just one. To be sure, the automotive industry is a unique animal. Compared ... » read more

Tech Talk: Configurable Logic
By Ed Sperling - 08 Oct, 2015 - Comments: 0

Cliff Lloyd, business development director at NXP Semiconductors, talks about designing in one part for many functions to reduce power consumption and cost. [youtube vid=ut5kCm0kNwE] » read more

What Will 7nm And 5nm Look Like?
By Mark LaPedus - 23 Jul, 2015 - Comments: 0

Citing an assortment of undisclosed manufacturing issues, Intel in July pushed out the introduction of its 10nm chip and process technology to the second half of 2017. This is roughly six or more months later than expected. With the delay at 10nm, [getentity id="22846" e_name="Intel"] also pushed out its process cadence from 2 to 2.5 years. Other foundries, meanwhile, are struggling to keep ... » read more

The Future Of Moore’s Law
By Ed Sperling - 22 Jul, 2015 - Comments: 0

Semiconductor Engineering sat down to discuss the future of Moore's Law with Jan Rabaey, Donald O. Pederson distinguished professor at [getentity id="22165" comment="UC Berkeley"]; Lucio Lanza, managing director of Lanza techVentures; Subramani Kengeri, vice president of advanced technology architecture at GlobalFoundries; Charlie Cheng, CEO of [getentity id="22135" e_name="Kilopass Technology"... » read more

Foundries Expand Planar Efforts
By Mark LaPedus - 18 Jun, 2015 - Comments: 0

Competition is heating up in the leading-edge foundry business, as vendors begin to ramp up their new 16nm/14nm finFET processes. But that’s not the only action in the foundry arena. They are also expanding their efforts in the leading-edge planar market by rolling out new 28nm and 22nm processes. On one front, TSMC is offering new 28nm variants, based on bulk CMOS technology. And on an... » read more

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