Manufacturing Bits: March 4

By Mark LaPedus - 04 Mar, 2014 - Comments: 0

Shrimp cocktail manufacturing Harvard's Wyss Institute has devised a new degradable bioplastic material, which was isolated from shrimp shells. The shrimp shell-based material could be used in the large-scale manufacturing of cell phones, food containers, toys and many other products. The material is also superior to most bioplastics on the market today. It could be used in place of existing... » read more

The Week In Review: Sept. 23

By Mark LaPedus - 23 Sep, 2013 - Comments: 0

By Mark LaPedus For some time, Apple’s iPhones have incorporated a separate RF switch and diversity switch from Peregrine Semiconductor (PSMI). The switches are based on a silicon-on-insulator (SOI) variant called silicon-on-sapphire (SOS). Murata takes Peregrine’s RF switches and integrates them into a module. Doug Freedman, an analyst with RBC Capital, said Apple is no longer using PSMI�... » read more

The Week In Review: July 8

By Mark LaPedus - 08 Jul, 2013 - Comments: 0

By Mark LaPedus Fab tool vendors this week will gather at the annual Semicon West trade show in San Francisco. The mood is expected to be both gloomy and upbeat, at least based on one new and mixed forecast. The semiconductor equipment market is projected to fall 7.4% in 2013, but it will grow 27.1% in 2014, according to VLSI Research. The forecast for semis is up 10% in 2013 and 8.3% growth i... » read more

G450C To Align Vendors During 450mm Transition

By Ed Sperling - 16 Aug, 2012 - Comments: 0

By David Lammers Innovation and synchronization among multiple companies do not often go hand in hand. But for the 450mm wafer transition to provide its full benefits, chip makers and their suppliers will need to do more than a simple wafer size scale up. That may lead the Global 450 Consortium (G450C) to serve as the proving ground for efforts to more closely match the electrical results o... » read more

CNSE Readying NFX Fab for G450C, EUV Efforts

By Ed Sperling - 26 Jun, 2012 - Comments: 0

By David Lammers Two key areas of the semiconductor industry’s future—the 450mm wafer transition and EUV lithography—are the focus of the new NFX (NanoFab Xtension) building now under construction at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany. [caption id="attachment_6322" align="alignright" width="120" caption="Alain Kaloyeros"][/caption] T... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: CNSE

Manufacturing Bits: March 4

The Week In Review: Sept. 23

The Week In Review: July 8

G450C To Align Vendors During 450mm Transition

CNSE Readying NFX Fab for G450C, EUV Efforts