Research Bits: Apr. 7


DNA scaffolds for 3D electronics Researchers from Columbia University, Brookhaven National Laboratory, and University of Minnesota used DNA to help create self-assembled 3D electronic devices with nanometer-size features. The team deposited arrays of gold squares on a surface, onto which they could attach short pieces of DNA. These served as anchors to which they could fasten eight-sided di... » read more

Research Bits: Apr. 1


Neuro-synaptic RAM Researchers from the National University of Singapore (NUS) and King Abdullah University of Science and Technology (KAUST) found that a standard silicon transistor can function like a biological neuron and synapse when arranged and operated in a specific way. The team was able to replicate both neural firing and synaptic weight changes by adjusting the resistance of the b... » read more

Chip Industry Technical Paper Roundup: Mar. 25


New technical papers recently added to Semiconductor Engineering’s library: [table id=415 /] Find more semiconductor research papers here. » read more

3D Photonic Integration For Ultra-Low-Energy, High-Bandwidth Interchip Data Links (Columbia et al.)


A new technical paper titled "Three-dimensional photonic integration for ultra-low-energy, high-bandwidth interchip data links" was published by researchers at Columbia University, Cornell University, Air Force Research Laboratory Information Directorate and Dartmouth College. Abstract "Artificial intelligence (AI) hardware is positioned to unlock revolutionary computational abilities by ... » read more

Research Bits: Mar. 4


Fiber computer Researchers from Massachusetts Institute of Technology (MIT), Rhode Island School of Design, and Brown University developed a programmable elastic fiber computer that could be woven into clothing to monitor health conditions and physical activity. Clothing created using the fiber computer was reported as comfortable and machine washable. The single elastic fiber computer cont... » read more

Chip Industry Week In Review


The EU Commission approved €920 million in German State aid to support Infineon in setting up its Smart Power Fab in Dresden. Total funding for the Dresden site amounts to about €1 billion. PDF Solutions will acquire secureWISE for $130 million to expand the reach of its semiconductor manufacturing data platform, providing secure, remote access monitoring and control. Tariffs, trade, and ... » read more

Chip Industry Technical Paper Roundup: Feb. 4


New technical papers recently added to Semiconductor Engineering’s library: [table id=403 /] Find all technical papers here. » read more

Topology And Connection Architecture Of CXL Pooling Systems (Microsoft, Columbia)


A new technical paper titled "Octopus: Scalable Low-Cost CXL Memory Pooling" was published by researchers at University of Washington, Microsoft Azure and Columbia University. Abstract "Compute Express Link (CXL) is widely-supported interconnect standard that promises to enable memory disaggregation in data centers. CXL allows for memory pooling, which can be used to create a shared memory ... » read more

Research Bits: Jan. 7


Deep UV microLED for maskless lithography Researchers from the Hong Kong University of Science and Technology, Southern University of Science and Technology, and the Suzhou Institute of Nanotechnology developed an aluminum gallium nitride deep-ultraviolet microLED display array for maskless lithography.  They also built a maskless lithography prototype platform. "The team achieved key brea... » read more

Chip Industry Technical Paper Roundup: July 16


New technical papers recently added to Semiconductor Engineering’s library. [table id=244 /] More ReadingTechnical Paper Library home   » read more

← Older posts