Simplifying the Connected Future: Navigating Complexity In The IoT Landscape


Smart home devices, appliances, ear buds, personal medical devices, smart energy meters, POS machines, asset, and fitness trackers, … Whatever device you can think of that makes our lives more convenient, safer and more enjoyable, in today’s world it’s likely to be connected, often wirelessly. Almost everywhere, connectivity is no longer an extra, it’s expected. And expectations are gro... » read more

Connectivity Challenges In Industry 4.0


Industry 4.0 is characterized by interoperability (such as IIoT), information transparency (digital plant models: virtual copy of physical world), technical support (the ability of cyber-physical systems to support humans by executing various tasks), and decentralized decision-making. IIoT allows devices to be connected, creating a virtual copy of real-world data that allows operators to visual... » read more

Programmable General-Purpose I/O


Talking to many different kinds of chips is becoming more complicated. There are new types of transistors, new protocols, and all of this is limited by the number of pins. Geoff Tate, CEO of Flex Logix, talks about adding programmability into the general-purpose I/O to enable more flexibility, lower inventory, and reduced obsolescence. » read more

Simplifying Integration And Security In Home Networks


An explosion of devices connected to the internet is driving vendors to implement standards that simplify the initial setup and improve security and integration with other devices, regardless of brand, network protocols, or country of origin. Farthest along in this multi-ecosystem merge is the Connectivity Standards Alliance (CSA), which today is supported by more than 500 companies, includi... » read more

Our Wireless World: How Wi-Fi 6 Will Seamlessly Integrate With 5G To Help Keep Us Connected


Most of us have a good understanding of what 5G is by now. Buzz around the fifth-generation wireless technology has reached a fever pitch – and for good reason.  It offers significantly greater bandwidth, faster connectivity, and lower latency, enabling it to power a much broader range of digital applications than its predecessors. 5G is ushering in a new wave of business and societal trans... » read more

Microelectronics And The AI Revolution


It is no secret that artificial intelligence and machine learning (AI/ML) are critical drivers for growth in electronics, and particularly, for semiconductors. The recent AI Hardware Summit showcased trends in AI/ML, both in enabling and using it in various application domains, including EDA. As part of the summit, Imec had organized a panel on “Advanced Microelectronics Technologies Driving ... » read more

Smart Home Device Communication In The Era Of Hyperconnectivity


In our increasingly hyperconnected world, a fascinating area to watch is what I would call "the last 100 feet, give or take." There are many standards like Wi-Fi, Bluetooth, Zigbee, or Thread used for IoT device connectivity. There are very active discussions about how our smart devices should be allowed to talk to other resources, like our neighbor's Wi-Fi. In the IoT's municipal and industria... » read more

Hyperconnectivity, Hyperscale Computing, And Moving Edges


As described in “The Four Pillars of Hyperscale Computing” last year, the four core components that development teams consider for data centers are computing, storage, memory, and networking. Over the previous decade, requirements for programmability have fundamentally changed data centers. Just over a decade ago, in 2010, virtual machines would compute user workloads on CPU-centric archite... » read more

Technology Access Discriminates


I try not to get on a soap box in my blogs, but I hope you will allow me to express a concern that I see building and the projection of an unintended outcome. I am talking about who does and does not have access to technology. Over time, this divide can cause a further division based on geography, income level, or some other factor. The ramifications of it are not realized until it is too late.... » read more

Hunting For Open Defects In Advanced Packages


Catching all defects in chip packaging is becoming more difficult, requiring a mix of electrical tests, metrology screening, and various types of inspection. And the more critical the application for these chips, the greater the effort and the cost. Latent open defects continue to be the bane of test, quality, and reliability engineering. Open defects in packages occur at the chip-to-substra... » read more

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