Going Deep Or Broad With Formal?

By Ann Mutschler - 28 Mar, 2018 - Comments: 0

Whether to apply [getkc id="33" comment="formal verification"] technology to semiconductor design broadly or deeply is a tough question. It hinges on what is the best way to achieve maximum ROI. Do you want to identify hard to find bugs, and get a certain level of confidence about a block? Where should the effort be placed? Is it by going deep, meaning a team of specialists or experts must b... » read more

Verification And Validation Brothers

By Brian Bailey - 22 Mar, 2018 - Comments: 0

At DVCon this year, Doug Amos took the stage for the [getentity id="22017" e_name="Mentor, a Siemens Business"] sponsored lunch presentation. For those of you who were there but decided to skip the lunch, expecting the traditional forced sales pitch, you made a mistake. Amos is one of those rare people who know how to inject humor, teaching and marketing into a single presentation such that the... » read more

How Much Verification Is Necessary?

By Ann Mutschler - 27 Jul, 2017 - Comments: 0

Since the advent of IC design flows, starting with RTL descriptions in languages like Verilog or VHDL, project teams have struggled with how much verification can and should be performed by the original RTL developers. Constrained-random methods based on high-level languages such as [gettech id="31021" t_name="e"] or [gettech id="31023" comment="SystemVerilog"] further cemented the role of t... » read more

Verification And The IoT

By Ed Sperling - 31 May, 2017 - Comments: 0

Semiconductor Engineering sat down to discuss what impact the IoT will have on the design cycle, with Christopher Lawless, director of external customer acceleration in [getentity id="22846" e_name="Intel"]'s Software Services Group; David Lacey, design and verification technologist at Hewlett Packard Enterprise; Jim Hogan, managing partner at Vista Ventures; Frank Schirrmeister, senior group d... » read more

Are Simulation’s Days Numbered?

By Brian Bailey - 24 Mar, 2016 - Comments: 0

In the latest EDAC report, the value of IP surpassed the value of CAE tools for the first time. Verification tools are an important part of establishing confidence in IP blocks and simulation has been the mainstay of that IP verification strategy. But simulation is under increasing pressure, particularly for full-chip and SoC verification, because it has failed to scale. While it still remains ... » read more

Making Hardware Design More Agile

By Ed Sperling - 12 Aug, 2015 - Comments: 1

Semiconductor engineering sat down to whether changes are needed in hardware design methodology, with Philip Gutierrez, ASIC/FPGA design manager in [getentity id="22306" comment="IBM"]'s FlashSystems Storage Group; Dennis Brophy, director of strategic business development at [getentity id="22017" e_name="Mentor Graphics"]; Frank Schirrmeister, group director for product marketing of the System ... » read more

Is Art Acceptable In Verification?

By Brian Bailey - 23 Apr, 2015 - Comments: 0

The industry appears to have accepted that [getkc id="10" kc_name="verification"] involves art as well as science. This is usually based on one of three reasons, namely: the problem is large and complex; there is a lack of understanding and tools that enable it to be automated; and if it could be made a science, all of the jobs would have migrated offshore. Today, designs are built from pre-... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer