tag: Cornell University

Universities Augment Engineering Curricula To Boost Employability
By Liz Allan - 05 Feb, 2025 - Comments: 0

Increasing numbers of universities are offering semiconductor courses in their engineering programs, and also in math, physics, and business degrees. Most universities now offer a broad foundation so students can pivot to other industries during cyclical downturns, or when technology and science create entirely new and potentially lucrative opportunities, such as generative AI, advanced pack... » read more

Chip Industry Technical Paper Roundup: Jan. 20
By Linda Christensen - 20 Jan, 2025 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=398 /] Find all technical papers here. » read more

AI Accelerators for Homomorphic Encryption Workloads
By Technical Paper Link - 15 Jan, 2025 - Comments: 0

A new technical paper titled "Leveraging ASIC AI Chips for Homomorphic Encryption" was published by researchers at Georgia Tech, MIT, Google and Cornell University. Abstract: "Cloud-based services are making the outsourcing of sensitive client data increasingly common. Although homomorphic encryption (HE) offers strong privacy guarantee, it requires substantially more resources than compu... » read more

Chip Industry Technical Paper Roundup: Oct. 29
By Linda Christensen - 29 Oct, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=375 /] More Reading Chip Industry Week In Review Intel’s EU court win; high-NA benchmarks and new maskless litho; SiC down, GaN up; Natcast’s plan; Xiaomi’s 3nm chip; semi tax credit rules; RISC-V; lithium mine; AI-edge expansion. Technical Paper Library home » read more

Research Bits: Oct. 29
By Jesse Allen - 29 Oct, 2024 - Comments: 0

Micro-LED DUV maskless lithography Researchers from the University of Science and Technology of China, Anhui GaN Semiconductor, and Wuhan University developed a vertically integrated micro-LED array for deep ultraviolet (DUV) maskless photolithography. The team fabricated a DUV display integrated chip with 564 pixels-per-inch density that uses a three-dimensional vertically integrated devic... » read more

Energy Analysis: 2D and 3D Architectures with Systolic Arrays and CIM (Cornell)
By Technical Paper Link - 22 Oct, 2024 - Comments: 0

A new technical paper titled "Energy-/Carbon-Aware Evaluation and Optimization of 3D IC Architecture with Digital Compute-in-Memory Designs" was published by researchers at Cornell University. "In this paper, we investigate digital CIM (DCIM) macros and various 3D architectures to find the opportunity of increased energy efficiency compared to 2D structures. Moreover, we also investigated th... » read more

Chip Industry Technical Paper Roundup: Oct. 1
By Linda Christensen - 01 Oct, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=360 /] More ReadingTechnical Paper Library home » read more

Dualtronics: Photonic Devices on the Cation Face and Electronic Devices on the Anion Face of the Same Wafer
By Technical Paper Link - 26 Sep, 2024 - Comments: 0

A new technical paper titled "Using both faces of polar semiconductor wafers for functional devices" was published by researchers at Cornell University and Polish Academy of Sciences. Find the technical paper here. Published September 2024. Cornell University's news release is here, stating "Cornell researchers, in collaboration with a team at the Polish Academy of Sciences, have develope... » read more

Chip Industry Week in Review
By The SE Staff - 30 Aug, 2024 - Comments: 1

The Biden-Harris Administration announced preliminary terms with HP for $50 million in direct funding under the CHIPs and Science Act to support the expansion and modernization of HP’s existing microfluidics and microelectromechanical systems (“MEMS”) facility in Corvallis, Oregon. CHIPS for America launched the CHIPS Metrology Community, a collaborative initiative designed to advance ... » read more

Research Bits: June 25
By Liz Allan - 25 Jun, 2024 - Comments: 0

Quantum on silicon Researchers at the Harvard John A. Paulson School of Engineering and Applied Sciences (SEAS) developed a platform to probe and control qubits in silicon for quantum networks, after an earlier discovery that defects in silicon could be used to send and store quantum information over widely used telecommunications wavelengths. The device uses an electric diode to manipulate... » read more

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