Chip Industry Week In Review

By The SE Staff - 11 Apr, 2025 - Comments: 0

Don't have time to read this? Check out Semiconductor Engineering's Inside Chips podcast. The U.S. Department of Commerce is investigating TSMC for potential export control violations involving Huawei chips, reports Reuters. The probe follows TechInsights' teardown of a Huawei AI accelerator chip last year. The foundry, meanwhile, maintains it has not shipped any chips to Huawei since 2020... » read more

Research Bits: Apr. 1

By Jesse Allen - 01 Apr, 2025 - Comments: 0

Neuro-synaptic RAM Researchers from the National University of Singapore (NUS) and King Abdullah University of Science and Technology (KAUST) found that a standard silicon transistor can function like a biological neuron and synapse when arranged and operated in a specific way. The team was able to replicate both neural firing and synaptic weight changes by adjusting the resistance of the b... » read more

Chip Industry Technical Paper Roundup: Mar. 25

By Linda Christensen - 25 Mar, 2025 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=415 /] Find more semiconductor research papers here. » read more

3D Photonic Integration For Ultra-Low-Energy, High-Bandwidth Interchip Data Links (Columbia et al.)

By Linda Christensen - 23 Mar, 2025 - Comments: 0

A new technical paper titled "Three-dimensional photonic integration for ultra-low-energy, high-bandwidth interchip data links" was published by researchers at Columbia University, Cornell University, Air Force Research Laboratory Information Directorate and Dartmouth College. Abstract "Artificial intelligence (AI) hardware is positioned to unlock revolutionary computational abilities by ... » read more

Universities Augment Engineering Curricula To Boost Employability

By Liz Allan - 05 Feb, 2025 - Comments: 0

Increasing numbers of universities are offering semiconductor courses in their engineering programs, and also in math, physics, and business degrees. Most universities now offer a broad foundation so students can pivot to other industries during cyclical downturns, or when technology and science create entirely new and potentially lucrative opportunities, such as generative AI, advanced pack... » read more

Chip Industry Technical Paper Roundup: Jan. 20

By Linda Christensen - 20 Jan, 2025 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=398 /] Find all technical papers here. » read more

AI Accelerators for Homomorphic Encryption Workloads

By Technical Paper Link - 15 Jan, 2025 - Comments: 0

A new technical paper titled "Leveraging ASIC AI Chips for Homomorphic Encryption" was published by researchers at Georgia Tech, MIT, Google and Cornell University. Abstract: "Cloud-based services are making the outsourcing of sensitive client data increasingly common. Although homomorphic encryption (HE) offers strong privacy guarantee, it requires substantially more resources than compu... » read more

Chip Industry Technical Paper Roundup: Oct. 29

By Linda Christensen - 29 Oct, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=375 /] More Reading Chip Industry Week In Review Intel’s EU court win; high-NA benchmarks and new maskless litho; SiC down, GaN up; Natcast’s plan; Xiaomi’s 3nm chip; semi tax credit rules; RISC-V; lithium mine; AI-edge expansion. Technical Paper Library home » read more

Research Bits: Oct. 29

By Jesse Allen - 29 Oct, 2024 - Comments: 0

Micro-LED DUV maskless lithography Researchers from the University of Science and Technology of China, Anhui GaN Semiconductor, and Wuhan University developed a vertically integrated micro-LED array for deep ultraviolet (DUV) maskless photolithography. The team fabricated a DUV display integrated chip with 564 pixels-per-inch density that uses a three-dimensional vertically integrated devic... » read more

Energy Analysis: 2D and 3D Architectures with Systolic Arrays and CIM (Cornell)

By Technical Paper Link - 22 Oct, 2024 - Comments: 0

A new technical paper titled "Energy-/Carbon-Aware Evaluation and Optimization of 3D IC Architecture with Digital Compute-in-Memory Designs" was published by researchers at Cornell University. "In this paper, we investigate digital CIM (DCIM) macros and various 3D architectures to find the opportunity of increased energy efficiency compared to 2D structures. Moreover, we also investigated th... » read more

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