System Bits: Feb. 28

By Ann Mutschler - 28 Feb, 2017 - Comments: 0

Software robots have fights lasting years According to University of Oxford and Alan Turing Institute researchers, editing bots on Wikipedia undo vandalism, enforce bans, check spelling, create links and import content automatically, whereas other non-editing bots mine data, identify data or identify copyright infringements — sometimes with unpredictable consequences. The team looked at h... » read more

Power/Performance Bits: Sept. 27

By Jesse Allen - 27 Sep, 2016 - Comments: 0

Self-organizing circuits Researchers studying the behavior of nanoscale materials at the Department of Energy's Oak Ridge National Laboratory discovered that due an unusual feature of certain complex oxides called phase separation, individual nanoscale regions can behave as self-organized circuit elements, which could support new multifunctional types of computing architectures. "Within a... » read more

IC Industry Waking Up To Security

By Jeff Dorsch - 02 Jun, 2016 - Comments: 0

By Jeff Dorsch & Ed Sperling Many people pay lip service to the concept of security in Internet of Things devices, software, and networks. That oversight is beginning to fade away, however, as companies begin digging into one of the broadest and most complex problems in the IoT age. Unlike other technology issues, which have been solved in increments, security is all-inclusive. While ... » read more

System Bits: March 1

By Ann Mutschler - 01 Mar, 2016 - Comments: 0

Current generation silicon wafer While the single-crystal silicon wafer changed the nature of communication 60 years ago, a group of Cornell researchers is now hoping its work with quantum dot solids can usher in a new era in electronics. In what could be the first step toward discovering and developing artificial materials with controllable electronic structure, the team has fashioned 2D s... » read more

Power/Performance Bits: Dec. 23

By Jesse Allen - 23 Dec, 2015 - Comments: 0

GaN building blocks A team of engineers from Cornell University, the University of Notre Dame, and the semiconductor company IQE created gallium nitride (GaN) power diodes capable of serving as the building blocks for future GaN power switches. In spite of having many desirable features as a material, GaN is notorious for its defects and reliability issues. So the team zeroed in on device... » read more

Can Nano-Patterning Save Moore’s Law?

By Mark LaPedus - 19 Nov, 2015 - Comments: 0

For years the academic community has explored a novel technology called selective deposition. Then, more than a year ago, Intel spearheaded an effort to bring the technology from the lab to the fab at 7nm or 5nm. Today, selective deposition is still in R&D, but it is gaining momentum in the industry. With R&D funding from Intel and others, selective deposition, sometimes called ALD-e... » read more

New Patterning Paradigm?

By Mark LaPedus - 16 Apr, 2015 - Comments: 0

Chip scaling is becoming more difficult at each process node, but the industry continues to find new and innovative ways to solve the problems at every turn. And so chipmakers continue to march down the various process nodes. But the question is for how much longer? In fact, at 16nm/14nm and beyond, chipmakers are finding new and different challenges, which, in turn, could slow IC scaling or br... » read more

Issues And Options At 5nm

By Mark LaPedus - 19 Mar, 2015 - Comments: 0

While the foundries are ramping up their processes for the 16nm/14nm node, vendors are also busy developing technologies for 10nm and beyond. In fact, chipmakers are finalizing their 10nm process offerings, but they are still weighing the technology options for 7nm. And if that isn’t enough, IC makers are beginning to look at the options at 5nm and beyond. Today, chipmakers can see a p... » read more

The Week In Review: Design/IoT

By Jesse Allen - 13 Feb, 2015 - Comments: 0

Mergers/Acquisitions ARM acquired Offspark, a Dutch company specializing in IoT communications security. Use of Offspark's PolarSSL embedded Transport Layer Security (TLS) solution is widespread in the IoT industry. PolarSSL will be rebranded mbed TLS and integrated into ARM's mbed OS. Tools Mentor Graphics is bringing together a suite of technologies that enable a multi-platform appro... » read more

System Bits: Feb. 10

By Ann Mutschler - 10 Feb, 2015 - Comments: 0

Mapping temperature Given that overheating is a major problem for chips today a team of UCLA and USC scientists have made a breakthrough that they believe should enable engineers to design microprocessors that minimize that problem with a thermal imaging technique that can see how the temperature changes from point to point inside the smallest electronic circuits. The technique is called pl... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Cornell University