Manufacturing Bits: Jan. 12

By Mark LaPedus - 12 Jan, 2016 - Comments: 0

World’s smallest magnet The University of Tokyo has developed what researchers claim is the world's smallest nano-magnet. The nano-size ferrite magnet consists of iron oxide. With the material, researches devised a 7.5nm structure with magnetic properties. [caption id="attachment_24751" align="alignleft" width="300"] Charting the world's smallest magnet (Source: Shin-ichi Ohkoshi)[/ca... » read more

Manufacturing Bits: Nov. 3

By Mark LaPedus - 03 Nov, 2015 - Comments: 0

World’s fastest phototransistor The University of Wisconsin-Madison has developed what the university claims is the world’s fastest and most responsive flexible silicon phototransistor. Phototransistors are semiconductor light sensors. They are based on a transistor with a transparent cover. They provide better sensitivity than a photodiode. The futuristic phototransistor from the Un... » read more

Manufacturing Bits: Sept. 1

By Mark LaPedus - 01 Sep, 2015 - Comments: 0

Free-electron laser EUV consortium Extreme ultraviolet (EUV) lithography is delayed. Chipmakers hope to insert EUV at the 7nm node, but that’s not a given. As before, the big problem is the EUV light source. So far, the source can’t generate enough power to enable the required throughput for EUV in high-volume production. ASML’s current EUV source is operating at 80 Watts, up from 10 ... » read more

Manufacturing Bits: August 5

By Mark LaPedus - 05 Aug, 2014 - Comments: 0

Double Big Mac chips Using molecular beam epitaxy (MBE), Cornell has devised a method of growing an emerging class of oxide films called Ruddlesden-Poppers. These oxides are layered structures, which consist of 2D-based perovskite slabs interleaved with cations. In the future, these structures could be used in various applications, such as superconductivity, magnetoresistance and ferromagne... » read more

Manufacturing Bits: April 22

By Mark LaPedus - 22 Apr, 2014 - Comments: 1

Detecting counterfeit goods Rare earths are chemical elements found in the Earth’s crust. They are critical for use in the production of cars, consumer electronics, computers, communications, clean energy, health care, national defense systems and others. Researchers are looking for new ways to integrate rare earths into potential chips and other applications. For example, the Massachuset... » read more

Manufacturing Bits: Feb. 18

By Mark LaPedus - 18 Feb, 2014 - Comments: 1

Polite cupcake helping robots Cornell and Carnegie Mellon have made a new discovery about robots. If they sound less snippy when they communicate, listeners will respond better. In fact, developers of robots should develop systems that use less confrontational language. In the study, entitled “How a Robot Should Give Advice,” researchers discovered that robots and humans are more lik... » read more

System Bits: Oct. 15

By Ann Mutschler - 15 Oct, 2013 - Comments: 0

Improving safety with talking vehicles Researchers at USC Viterbi have spent nearly a decade working on algorithms and software to make it possible for cars to “talk” to one another by sending messages through an ad hoc wireless network to alert drivers of impending dangers such as potholes and icy roads to prevent accidents, injuries and the accompanying traffic jams. It’s all about hav... » read more

Newer posts →

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer