Meeting Functional Safety Requirements Efficiently Via Electronic Design Tools And Techniques

By Cadence - 22 Apr, 2015 - Comments: 0

In an intelligent electronic system, unexpected errors can lead to unplanned, unexpected behavior. This can be a potentially dangerous proposition for, say, an automotive manufacturer, as well as a costly occurrence for consumer product developers. Compliance to the latest safety standards can be a laborious, time-consuming process. Fortunately, there are now technologies available that can aut... » read more

Designing For Automotive

By Ann Mutschler - 15 Jan, 2015 - Comments: 0

As cars include an increasing amount of electronics and electronics subsystems, the number of design challenges involving reliability, cost and power are on the rise. “Reliability tops the list of concerns for the design team because when you put these electronics in, you must know if they are going to operate efficiently by themselves," said Aveek Sarkar, vice president of product enginee... » read more

More Things Are Critical Systems

By Ed Sperling - 10 Nov, 2014 - Comments: 0

Defining a critical system used to be pretty obvious. It was something that could affect the health and safety of people, such as the chip inside a pacemaker or insulin pump, a car's braking system or an airplane's guidance system. But as more devices are connected together, that definition is changing and expanding. More devices are now considered critical, such as a connected baby monitor ... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: critical systems

Meeting Functional Safety Requirements Efficiently Via Electronic Design Tools And Techniques

Designing For Automotive

More Things Are Critical Systems