CXL Memory: Detailed Characterization Analysis Using Micro-Benchmarks And Real Applications (UIUC, Intel Labs)

By Technical Paper Link - 30 Mar, 2023 - Comments: 0

A new technical paper titled "Demystifying CXL Memory with Genuine CXL-Ready Systems and Devices" was published by researchers at University of Illinois Urbana-Champaign (UIUC) and Intel Labs. Abstract: "The high demand for memory capacity in modern datacenters has led to multiple lines of innovation in memory expansion and disaggregation. One such effort is Compute eXpress Link (CXL)-based... » read more

Finding the Scope of CXL-Enabled Tiered Memory System in Production

By Technical Paper Link - 25 Aug, 2022 - Comments: 0

This new technical paper titled "TPP: Transparent Page Placement for CXL-Enabled Tiered Memory" is presented by researchers at University of Michigan and Meta Inc. Abstract (partial) "We propose a novel OS-level application-transparent page placement mechanism (TPP) for efficient memory management. TPP employs a lightweight mechanism to identify and place hot and cold pages to appropriate... » read more

CXL Memory Interconnect Initiative: Enabling A New Era of Data Center Architecture

By Rambus - 30 Jun, 2021 - Comments: 0

In response to an exponential growth in data, the industry is on the threshold of a groundbreaking architectural shift that will fundamentally change the performance, efficiency and cost of data centers around the globe. Server architecture, which has remained largely unchanged for decades, is taking a revolutionary step forward to address the growing demand for data and the voracious performan... » read more

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tag: CXL memory

CXL Memory: Detailed Characterization Analysis Using Micro-Benchmarks And Real Applications (UIUC, Intel Labs)

Finding the Scope of CXL-Enabled Tiered Memory System in Production

CXL Memory Interconnect Initiative: Enabling A New Era of Data Center Architecture

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tag: CXL memory

CXL Memory: Detailed Characterization Analysis Using Micro-Benchmarks And Real Applications (UIUC, Intel Labs)

Finding the Scope of CXL-Enabled Tiered Memory System in Production

CXL Memory Interconnect Initiative: Enabling A New Era of Data Center Architecture

Trending Articles

Shift Left Is The Tip Of The Iceberg

Hybrid Bonding Makes Strides Toward Manufacturability

Americas Chip Funding Energizes Industry

Advanced Packaging Driving New Collaboration Across Supply Chain

Chiplets Make Progress Using Interconnects As Glue

Knowledge Centers Entities, people and technologies explored

Related Articles

Shift Left Is The Tip Of The Iceberg

Partitioning In The Chiplet Era

3.5D: The Great Compromise

AI’s Role In Chip Design Widens, Drawing In New Startups

Key Technologies To Extend EUV To 14 Angstroms

What Comes After HBM For Chiplets

Memory Fundamentals For Engineers

Why Small Fab And Assembly Houses Are Thriving

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