Week In Review: Design, Low Power


M&A Synopsys acquired Moortec, a provider of in-chip monitoring technology specializing in process, voltage and temperature (PVT) sensors. Moortec's sensors will be a key component to Synopsys' new Silicon Lifecycle Management (SLM) platform. "This acquisition accelerates the expansion of our SLM platform by providing our customers with a comprehensive data-analytics-driven solution for de... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive Cadence achieved ASIL Level B in support of D (ASIL B(D))-compliant certification for its Tensilica ConnX B10 and ConnX B20 DSPs, which are designed for automotive radar, lidar, and vehicle-to-everything (V2X). SGS-TÜV Saar certified that the DSPs have support for random hardware faults and systematic faults. Synopsys is acquiring Moortec, whose process, voltage, and temperature... » read more

AI & IP In Edge Computing For Faster 5G And The IoT


Edge computing, which is the concept of processing and analyzing data in servers closer to the applications they serve, is growing in popularity and opening new markets for established telecom providers, semiconductor startups, and new software ecosystems. It’s brilliant how technology has come together over the last several decades to enable this new space starting with Big Data and the idea... » read more

Rethinking Competitive One Upmanship Among Foundries


The winner in the foundry business used to be determined by who got to the most advanced process node first. For the most part that benchmark no longer works. Unlike in the past, when all of the foundries and IDMs competed using basically the same process, each foundry has gone its own route. This is primarily due to the divergence of end markets, and the realization that as costs increase, ... » read more

Power Impact At The Physical Layer Causes Downstream Effects


Data movement is rapidly emerging as one of the top design challenges, and it is being complicated by new chip architectures and physical effects caused by increasing density at advanced nodes and in multi-chip systems. Until the introduction of the latest revs of high-bandwidth memory, as well as GDDR6, memory was considered the next big bottleneck. But other compute bottlenecks have been e... » read more

Different Levels Of Interconnects


The interconnect hierarchy from metal 0 in a semiconductor all the way up to racks of servers. Kurt Shuler, vice president of marketing at Arteris IP, explains why each one is different, and how every level can contribute to latency and performance. » read more

Week In Review: Auto, Security, Pervasive Computing


Edge, cloud, data center Cadence added new verification IP (VIP) for hyperscalar data centers that supports CXL – Compute Express Link, HBM3, and Ethernet 802.3ck. The VIP are part of Cadence’s Verification Suite. Cadence also released IP for 56G long-reach SerDes on TSMC’s N7 and N6 process technologies. Many Mentor, a Siemens Business, IC design tools are now certified TSMC’s N5 a... » read more

Choosing Between CCIX And CXL


Semiconductor Engineering sat down to the discuss the pros and cons of the Compute Express Link (CXL) and the Cache Coherent Interconnect for Accelerators (CCIX) with Kurt Shuler, vice president of marketing at Arteris IP; Richard Solomon, technical marketing manager for PCI Express controller IP at Synopsys; and Jitendra Mohan, CEO of Astera Labs. What follows are excerpts of that conversati... » read more

Which Chip Interconnect Protocol Is Better?


Semiconductor Engineering sat down to the discuss the pros and cons of the Compute Express Link (CXL) and the Cache Coherent Interconnect for Accelerators (CCIX) with Kurt Shuler, vice president of marketing at Arteris IP; Richard Solomon, technical marketing manager for PCI Express controller IP at Synopsys; and Jitendra Mohan, CEO of Astera Labs. What follows are excerpts of that conversation... » read more

How AI In Edge Computing Drives 5G And The IoT


Edge computing, which is the concept of processing and analyzing data in servers closer to the applications they serve, is growing in popularity and opening new markets for established telecom providers, semiconductor startups, and new software ecosystems. It’s brilliant how technology has come together over the last several decades to enable this new space starting with Big Data and the idea... » read more

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