All-in-One Vs. Point Tools For Security


Security remains an urgent concern for builders of any system that might tempt attackers, but designers find themselves faced with a bewildering array of security options. Some of those are point solutions for specific pieces of the security puzzle. Others bill themselves as all-in-one, where the whole puzzle filled in. Which approach is best depends on the resources you have available and y... » read more

Memory Issues For AI Edge Chips


Several companies are developing or ramping up AI chips for systems on the network edge, but vendors face a variety of challenges around process nodes and memory choices that can vary greatly from one application to the next. The network edge involves a class of products ranging from cars and drones to security cameras, smart speakers and even enterprise servers. All of these applications in... » read more

Utilizing Computational Memory


For systems to become faster and consume less power, they must stop wasting the power required to move data around and start adding processing near memory. This approach has been proven, and products are entering the marketplace designed to fill a number of roles. Processing near memory, also known as computational memory, has been hiding in the shadows for more than a decade. Ever since the... » read more

Solving The Memory Bottleneck


Chipmakers are scrambling to solve the bottleneck between processor and memory, and they are turning out new designs based on different architectures at a rate no one would have anticipated even several months ago. At issue is how to boost performance in systems, particularly those at the edge, where huge amounts of data need to be processed locally or regionally. The traditional approach ha... » read more

Week In Review: Manufacturing, Test


Chipmakers United Microelectronics Corp. (UMC) has satisfied all closing conditions for the full acquisition of Mie Fujitsu Semiconductor Ltd. (MIFS), the former 300mm wafer foundry joint venture between UMC and Fujitsu Semiconductor Ltd. (FSL). The completion of the acquisition is scheduled for Oct. 1. In 2014, FSL and UMC agreed for UMC to acquire a 15.9% stake in MIFS from FSL through pr... » read more

Week In Review: Manufacturing, Test


Chipmakers Foxconn is in talks to build a fab in Zhuhai, China, according to a report from Nikkei. The fab, to cost $9 billion, would make chips for Foxconn and outside companies, the report said, which says the company will enter the foundry business. The European Commission has approved funding for 1.75 billion euros ($2 billion) of public investment for projects in the microelectronics... » read more

Bugs That Kill


Are simulation-resistant superbugs stifling innovation? That is a question Craig Shirley, president and CEO of Oski Technology, asked a collection of semiconductor executives over dinner. Semiconductor Engineering was invited to hear that discussion and to present the key points of the discussion. To promote free conversation, the participants, who are listed below, asked not to be quoted di... » read more

Memory Startups To Watch


The next-generation memories are finally ramping up after years’ of delays and promises. Intel, for one, is shipping 3D XPoint, a next-generation technology based on phase-change memory. In addition, the big foundries are readying embedded MRAM. And, of course, there are a number of other players in the next-generation memory arena. There are also a number of startups that are flying un... » read more

Embedded Flash Scaling Limits


Embedded nonvolatile flash memory has played a key role in chips for years, but the technology is beginning to face some scaling and cost roadblocks and it’s not clear what comes next. Embedded flash is used in several markets, such as automotive, consumer and industrial. But the automotive sector appears to be the most concerned about the future of the technology. Typically, a car incorpo... » read more

Will China Succeed In Memory?


China's fledging memory makers are expected to reach a major milestone and move into initial production this year, although vendors are already running into various roadblocks. China's domestic vendors are focusing on two markets, 3D NAND and DRAM. In both cases local vendors are either behind in technology, struggling to develop these products, or both. And one vendor recently was hit with ... » read more

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