tag: D2S

Challenges Mount For Photomasks
By Mark LaPedus - 21 Sep, 2017 - Comments: 3

Semiconductor Engineering sat down to discuss photomask technologies with Naoya Hayashi, research fellow at Dai Nippon Printing (DNP); Banqiu Wu, principal member of the technical staff and chief technology officer of the Mask and TSV Etch Division at [getentity id="22817" e_name="Applied Materials"]; Weston Sousa, general manager of the Reticle Products Division at [getentity id="22876" commen... » read more

Blog Review: Sept. 20
By Jesse Allen - 20 Sep, 2017 - Comments: 0

Mentor's Jeff Miller warns that MEMS accelerometers are vulnerable to takeover using specially constructed sound waves, as demonstrated in a new paper. Synopsys' Pooja Gupta and Srinivas Vijayaragavan explain some major technology updates in SAS 24G with a look at Binary primitives, Extended Binary primitives and primitive parameters. Cadence's Paul McLellan shares highlights from TSMC's ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 15 Sep, 2017 - Comments: 0

Chipmakers Toshiba has changed its mind yet again about which group will buy its prized memory unit. On June 20, Toshiba chose a Japanese government-led consortium of INCJ/DBJ, Bain Capital and South Korea’s SK Hynix. Then, Toshiba changed its mind and selected a similar group with Western Digital (WDC), leaving SK Hynix on the outside looking in. This week, Toshiba signed a deal with a B... » read more

Survey: Optimism Grows for EUV
By Mark LaPedus - 11 Sep, 2017 - Comments: 1

The optimism is growing for extreme ultraviolet (EUV) lithography in the market, according to a pair of new surveys released by the eBeam Initiative, which also revealed some new and surprising data about mask writing tools and other photomask technology. In one of the surveys from the [getentity id="22818" e_name="eBeam Initiative"], respondents revealed that they are more optimistic than e... » read more

Getting Ready For EUV
By Jan Willis - 06 Sep, 2017 - Comments: 0

The highly anticipated introduction of extreme ultra-violet (EUV) lithography is reflected in recent surveys conducted by the eBeam Initiative, which will be presented on Sept. 11 at the annual Photomask Technology Symposium in Monterey, Calif.  There are many changes are coming to the mask industry, in addition to EUV. Those include greater use of inverse-lithography technologies (ILT) and... » read more

What’s Changing At BACUS
By Jan Willis - 17 Aug, 2017 - Comments: 0

Jim Wiley, president of SPIE BACUS, talks about this year's merger of the EUV Lithography Symposium and the SPIE Photomask Conference—including what's new and different, the latest updates on the event location, and topics to look forward to such as EUV mask inspection—as well as his predictions on machine learning. https://youtu.be/GNxUmMAU9zs » read more

The Secret Life Of Accelerators
By Ed Sperling - 27 Jul, 2017 - Comments: 0

Accelerator chips increasingly are providing the performance boost that device scaling once provided, changing basic assumptions about how data moves within an electronic system and where it should be processed. To the outside world, little appears to have changed. But beneath the glossy exterior, and almost always hidden from view, accelerator chips are becoming an integral part of most des... » read more

What’s After FinFETs?
By Mark LaPedus - 24 Jul, 2017 - Comments: 3

Chipmakers are readying their next-generation technologies based on 10nm and/or 7nm finFETs, but it's still not clear how long the finFET will last, how long the 10nm and 7nm nodes for high-end devices will be extended, and what comes next. The industry faces a multitude of uncertainties and challenges at 5nm, 3nm and beyond. Even today, traditional chip scaling continues to slow as process ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 21 Jul, 2017 - Comments: 1

Fab equipment ASML posted strong sales in the quarter and is apparently nearly sold out of scanners based on extreme ultraviolet (EUV) lithography, according to analysts. “ASML posted strong 2Q results and 2Q guidance, providing further evidence that demand remains high for semiconductor equipment,” said Weston Twigg, an analyst with KeyBanc Capital Markets, in a research note. “Demand d... » read more

Mask Modeling In The EUV Era
By Ryan Pearman - 20 Jul, 2017 - Comments: 0

D2S reviews the challenges of mask modeling in the EUV era, including the need for dose/shape separation and mid-range correction, and the impact of GPU acceleration. https://youtu.be/iVqkoVMbK4o » read more

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