Electronics Supply-Chain Trust Standards Emerge

By Bryon Moyer - 07 Jan, 2021 - Comments: 0

Creative new ideas for electronics supply-chain trust are in rich supply, whether securing identity, protecting logistics, or establishing provenance. But underlying these efforts are wide-ranging standards in development from a broad set of organizations. Today, no one-stop-shop for supply-chain standards exists. Instead, there is huge fragmentation. It can be difficult to identify all of t... » read more

Manufacturing Bits: Jan. 5

By Mark LaPedus - 05 Jan, 2021 - Comments: 0

Gallium oxide chips The National Renewable Energy Laboratory (NREL), the Colorado School of Mines, and Saint-Gobain Crystals have teamed up to develop manufacturing technologies and devices based on an emerging material called gallium oxide. This work is part of a three-year program, dubbed the Oxide Electronic Devices for Extreme Operating Environments project, which is funded by the U.S. ... » read more

Week In Review: Design, Low Power

By Jesse Allen - 18 Dec, 2020 - Comments: 0

Tools, Cloud, IP Valtrix Systems updated its STING design verification tool for RISC-V based CPU and SoC implementations. Version 1.9.0 adds support to verify recent changes to the RISC-V user and privilege specifications, including draft versions of the vector and bit manipulation standard extensions. Preliminary support for the draft version of the RISC-V hypervisor extension has also been a... » read more

New Security Approaches, New Threats

By Ed Sperling - 09 Dec, 2020 - Comments: 0

New and different approaches to security are gaining a foothold as the life expectancy for advanced chips increases, and as emerging technologies such as quantum computing threaten to crack even the most complex encryption schemes. These approaches include everything from homomorphic encryption, where data is processed without being decrypted, to different ways of sending and receiving data ... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 04 Dec, 2020 - Comments: 0

Packaging and EMS ASE is expanding its efforts in the electronic manufacturing services (EMS) business. Universal Scientific Industrial (USI), a subsidiary of ASE, has completed the acquisition of Asteelflash Group through the acquisition of its parent company, Financière. USI provides electronic design and manufacturing services. It also provides system-in-package (SiP) modules. Asteelfla... » read more

Security Gaps In Open Source Hardware And AI

By Ed Sperling - 25 Nov, 2020 - Comments: 1

Semiconductor Engineering sat down to discuss security risks across multiple market segments with Helena Handschuh, security technologies fellow at Rambus; Mike Borza, principal security technologist for the Solutions Group at Synopsys; Steve Carlson, director of aerospace and defense solutions at Cadence; Alric Althoff, senior hardware security engineer at Tortuga Logic; and Joe Kiniry, princi... » read more

Disaggregation And Smarter Chips Shift Liability For Security

By Ed Sperling - 17 Nov, 2020 - Comments: 0

Semiconductor Engineering sat down to discuss security on chips with Vic Kulkarni, vice president and chief strategist at Ansys; Jason Oberg, CTO and co-founder of Tortuga Logic; Pamela Norton, CEO and founder of Borsetta; Ron Perez, fellow and technical lead for security architecture at Intel; and Tim Whitfield, vice president of strategy at Arm. What follows are excerpts of that conversation,... » read more

Building Billions Of Batteryless Devices

By James Myers - 12 Nov, 2020 - Comments: 0

Later this month, Arm will celebrate its 30 year anniversary and the engineering milestones that have resulted in more than 180 billion Arm-based chips being shipped in everything from sensors to smartphones to the world’s fastest supercomputer. In each of these cases, much of Arm’s success has been in our dedication to delivering the highest performance per watt. But while Arm may ha... » read more

Designs Beyond The Reticle Limit

By Brian Bailey - 12 Nov, 2020 - Comments: 0

Designs continue to grow in size and complexity, but today they are reaching both physical and economic challenges. These challenges are causing a reversal of the integration trend that has provided much of the performance and power gains over the past couple of decades. The industry, far from giving up, is exploring new ways to enable designs to go beyond the reticle size, which is around 8... » read more

Much Smarter Manufacturing

By Ed Sperling - 22 Oct, 2020 - Comments: 0

Smart manufacturing is undergoing some fundamental changes as more sensors are integrated across fabs to generate more usable data, and as AI/ML systems are deployed to sift through that data and identify patterns and anomalies more quickly. The concept of smart manufacturing — also referred to as Industrie 4.0 in Europe, for the fourth industrial revolution — emerged from the World Econ... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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