Safety Plus Security: Solutions And Methodologies

By Ed Sperling - 26 Jun, 2017 - Comments: 0

By Ed Sperling & Brian Bailey As more technology makes its way into safety-critical markets—and as more of those devices are connected to the Internet—security issues are beginning to merge with safety issues. The number of attempted cyberattacks is up on every front, which has big implications for devices used in safety-related applications. There are more viruses, ransomware, an... » read more

Manufacturing Bits: June 6

By Mark LaPedus - 06 Jun, 2017 - Comments: 0

Molecular black holes A group of researchers have used an ultra-bright pulse of X-ray light to hit a tiny atom in a molecule, causing the structure to explode and create a “molecular black hole.” The molecular black hole is different than a black hole in space, however. A black hole is a region in space, which has a gravitational field so strong that no matter or light can escape it. ... » read more

The Week In Review: Design

By Jesse Allen - 27 Jan, 2017 - Comments: 0

Tools Cadence launched its Sigrity 2017 technology portfolio for PCB power and signal integrity signoff, adding a power topology viewer and editor, library management for power integrity models, and a PCI Express 4.0 compliance kit for checking signal integrity. Memory Spin Transfer Technologies delivered samples of fully functional ST-MRAM (spin transfer magneto-resistive random acces... » read more

Morphing Moore’s Law

By Ed Sperling - 15 Dec, 2016 - Comments: 0

In 1965, Gordon Moore defined a timetable for doubling the number of transistors on a piece of silicon every two years. The law, as he originally defined it, is now hopelessly outdated. Any attempts to apply it to the most advanced chips today are a stretch at best, and complete fiction at worst. No one is on a two-year cadence between process nodes anymore—not even Intel. In fact, no one ... » read more

Advanced Packaging Requires Better Yield

By Ed Sperling - 17 Nov, 2016 - Comments: 1

Whether Moore's Laws truly ends, or whether the semiconductor industry reaches into the Angstrom world after 3nm—the semiconductor industry dislikes fractions—advanced packaging increasingly will dominate semiconductor designs. Apple already is on board with its iPhone 7, using TSMC's fan-out approach. And all of the major foundries and OSATs are lining up with a long list of capabilitie... » read more

Making 2.5D, Fan-Outs Cheaper

By Ed Sperling - 17 Nov, 2016 - Comments: 2

Now that it has been shown to work, the race is on to make advanced [getkc id="27" kc_name="packaging"] more affordable. While device scaling could continue for another decade or more, the number of companies that can afford to develop SoCs at the leading edge will continue to decline. The question now being addressed is what can supplant it, supplement it, or redefine it. At the center o... » read more

The Week In Review: IoT

By Jeff Dorsch - 21 Oct, 2016 - Comments: 0

Security The Defense Advanced Research Projects Agency (DARPA) in August held the finals of its Cyber Grand Challenge, a competition that came down to seven teams in Las Vegas, with the three winning teams sharing cash prizes totaling $3.75 million. The capture-the-flag style contest let cybersecurity software counter various attacks on its own, without the aid of engineers and programmers. Th... » read more

Joint R&D Has Its Ups And Downs

By Jeff Dorsch - 07 Sep, 2016 - Comments: 0

As corporate spending on research and development dwindles, enterprises are reaching out to colleges and universities to supplement their R&D. And they often are finding eager partners in those endeavors, as professors and their graduate students look for help, financial and technical, in addressing long-term research projects. “Pure research is just a luxury no one can afford anymore,... » read more

Manufacturing Bits: Sept. 6

By Mark LaPedus - 06 Sep, 2016 - Comments: 0

DARPA ALD The University of Colorado at Boulder has developed an atomic layer deposition (ALD) technology that can be performed at room temperatures. The technology, dubbed electron-enhanced ALD (EE-ALD), has been developed as part of the Local Control of Materials Synthesis (LoCo) program at the U.S. Defense Advanced Research Projects Agency (DARPA). The LoCo program is developing tech... » read more

System Bits: Aug. 23

By Ann Mutschler - 23 Aug, 2016 - Comments: 0

Monitor side-channel signals for IoT device security Thanks to a Defense Advanced Research Projects Agency (DARPA) grant, Georgia Tech researchers are working to develop a new technique for wirelessly monitoring IoT devices for malicious software – without affecting the operation of the ubiquitous, and low-power equipment. The team said the technique will rely on receiving and analyzing s... » read more

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tag: DARPA

Safety Plus Security: Solutions And Methodologies

Manufacturing Bits: June 6

The Week In Review: Design

Morphing Moore’s Law

Advanced Packaging Requires Better Yield

Making 2.5D, Fan-Outs Cheaper

The Week In Review: IoT

Joint R&D Has Its Ups And Downs

Manufacturing Bits: Sept. 6

System Bits: Aug. 23

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