GDDR6 Memory On The Leading Edge


With the accelerating growth in data traffic, it is unsurprising that the number of hyperscale data centers keeps rocketing skyward. According to analysts at the Synergy Research Group, in nine months (Q2’20 to Q1’21), 84 new hyperscale data centers came online bringing the total worldwide to 625. Hyperscaler capex set a record $150B over the last four quarters eclipsing the $121B spent in ... » read more

Challenges For New AI Processor Architectures


Investment money is flooding into the development of new AI processors for the data center, but the problems here are unique, the results are unpredictable, and the competition has deep pockets and very sticky products. The biggest issue may be insufficient data about the end market. When designing a new AI processor, every design team has to answer one fundamental question — how much flex... » read more

Sweeping Changes Ahead For Systems Design


Data centers are undergoing a fundamental change, shifting from standard processing models to more data-centric approaches based upon customized hardware, less movement of data, and more pooling of resources. Driven by a flood of web searches, Bitcoin mining, video streaming, data centers are in a race to provide the most efficient and fastest processing possible. But because there are so ma... » read more

For The Edge, It’s All About Location, Location, Location


They are centrally located, are connected to power grids and water systems, and are rapidly thinning out. And you can probably get a new cell phone case or a corn dog in the atrium. Could shopping malls become a future home for the edge? Edge computing has transformed over the last few years from being a vaguely defined concept to a fundamental part of the future data infrastructure. Band... » read more

Hyperconnectivity’s Impact On Consumers


Do you know what hyperconnectivity is? It is already affecting you, whether you know it or not. Hyperscalers are the companies like AWS, Google, and Microsoft that build and run those enormous (aka hyperscale) data centers. If you are a designer and use the cloud, then you have at least a vague idea of what data centers are being used to handle your design. But even if you are the generic perso... » read more

CXL Signals A New Era Of Data Center Architecture


An exponential rise in data volume and traffic across the global internet infrastructure is motivating exploration of new architectures for the data center. Disaggregation and composability would move us beyond the classic architecture of the server as the unit of computing. By separating the functional components of compute, memory, storage and networking into pools, composed on-demand to matc... » read more

Rocky Road To Designing Chips In The Cloud


EDA is moving to the cloud in fits and starts as tool vendors sort out complex financial models and tradeoffs while recognizing a potentially big new opportunity to provide unlimited processing capacity using a pay-as-you-go approach. By all accounts, a tremendous amount of tire-kicking is happening now as EDA vendors and users delve into the how and why of moving to the cloud for chip desig... » read more

The Rise Of SmartNICs


Network interface cards (NICs) have been on the market since shortly after the first PCs in the mid-1980s. However, over the past few years, we’ve seen the emergence of SmartNICs. What is a SmartNIC? The most basic definition of a SmartNIC is simply a programmable NIC. Others have overloaded the concept by heaping vast amounts of silicon and firmware into their implementations. A good work... » read more

Hyperconnectivity, Hyperscale Computing, And Moving Edges


As described in “The Four Pillars of Hyperscale Computing” last year, the four core components that development teams consider for data centers are computing, storage, memory, and networking. Over the previous decade, requirements for programmability have fundamentally changed data centers. Just over a decade ago, in 2010, virtual machines would compute user workloads on CPU-centric archite... » read more

Making Chip Packaging More Reliable


Packaging houses are readying the next wave of IC packages, but these products must prove to be reliable before they are incorporated into systems. These packages involve several advanced technologies, such as 2.5D/3D, chiplets and fan-out, but vendors also are working on new versions of more mature package types, like wirebond and leadframe technologies. As with previous products, packaging... » read more

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