An Insider’s Guide To Planar And 3D DRAM


Semiconductor Engineering sat down to talk about planar DRAMs, 3D DRAMs, scaling and systems design with Charles Slayman, technical leader of engineering at network equipment giant Cisco Systems. What follows are excerpts of that conversation. SE: What types of DRAM do network equipment OEMs look at or buy these days? Slayman: When we look at DRAM, we look at it for networking applicatio... » read more

Memory Choices Grow


Memory is becoming one of the starting points for SoC architectures, evolving from a basic checklist item that was almost always in the shadow of improving processor performance or lowering the overall power budget. In conjunction with that shift, chipmakers must now grapple with many more front-end decisions about placement, memory type and access prioritization. There are plenty of rules ... » read more

Overcoming The Design Bottleneck


SoCs control most advanced electronics these days and functionality, quality, power and security are a combination of both hardware and software. All throughout the development of today's complex systems, the memory hierarchy has remained the same—preserving the notion of a continuous computing paradigm. Today, that decision is leading to performance and power issues. There are several rea... » read more

Blog Review: Aug. 26


Synopsys' Marc Greenberg attended IDF and learned more about the newly announced Intel/Micron 3D XPoint memory technology named Optane including initial ship dates and some implementation details. In concluding his analysis of the 2014 Functional Verification Study, Mentor's Harry Foster reveals an unexpected finding about design size and respins. How do you keep your power grid from bein... » read more

Inside The 5G Smartphone


Amid a slowdown in the cell phone business, the market is heating up for perhaps the next big thing in wireless—5th generation mobile networks or 5G. In fact, major carriers, chipmakers and telecom equipment vendors are all rushing to get a piece of the action in 5G, which is the follow-on to the current wireless standard known as 4G or long-term evolution (LTE). Intel, Samsung and Qualcom... » read more

Tech Talk: DDR4


Rambus' Ely Tsern digs into the challenges in integrating DDR4 compared with DDR3 and why it will get even more difficult over the next few iterations. [youtube vid=2M6vFweaZ-M] » read more

Fundamental Shifts In Chip Business


Shifting business models, acquisitions, minority investments and increasing uncertainty are creating fundamental shifts in the semiconductor industry that could redefine who is successful in which markets for years to come. The announcement today that [getentity id="22671" e_name="Rambus"] is developing memory controller chips, expanding its business beyond just creating IP for the memory an... » read more

Don’t Let The Headlines Trick You


This is the time of year when reports get issued summarizing the sales results of the server market in the first quarter. As a way of grabbing attention, many of the headlines will mention that the results of the first quarter are below those of the fourth quarter, bringing to mind all sorts of doomsday scenarios. Don’t be fooled. In many industries, sales exhibit a large seasonal compo... » read more

More Data, Different Approaches


Scaling, rising complexity, and integration are all contributing to an explosion in data, from initial design to physical layout to verification and into the manufacturing phase. Now the question is what to do with all of that data. For SoC designs, that data is critical for identifying real and potential problems. It also allows verification engineers working the back end of the design flow... » read more

How Is Your HBM Memory?


The seemingly countless applications used every day requiring web access (social media, streaming video, games, etc.) are not only driving the need to store a tremendous amount of data, but also driving the need to access this data with as little delay as possible. Add to this list the growing number of connected devices (IoT), and you can see why changes in the data center are needed, in parti... » read more

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