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New Metrology and Inspection Technologies Needed for More-Than-Moore Markets


The escalating costs of following Moore’s Law have shifted the semiconductor industry’s focus to More-than-Moore (MtM) technologies, where analog/mixed-signal, RF, MEMS, image sensing, power or other technologies may be integrated with CMOS in a variety of planar, 2.5D and 3D architectures. The integration of these and other key technologies is enabling a host of fast-growing application... » read more

Seeing Spots At 10nm


By Ed Sperling The relentless march to smaller process nodes means the defects are getting smaller, more numerous, and much harder to find. That explains why Applied Materials and KLA-Tencor both introduced new defect review and classification tools last week. The move to the 1x nm is on the top of both companies’ agendas, and with that comes defects on the walls of finFETs in addition to... » read more