Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 31 Jan, 2020 - Comments: 0

AI/Edge Brewer Science is introducing its first material for permanent bond used in assembling ICs, image sensor devices, and MEMS for devices and packaging that “include low-temperature bonding, extreme chemical resistance, UV or thermal curable bonding process, and no material movement after cure,” according to a press release. The bond is part of the PermaSOL product family. “These hi... » read more

Making Sure A Heterogeneous Design Will Work

By Ed Sperling - 03 Dec, 2018 - Comments: 0

An explosion of various types of processors and localized memories on a chip or in a package is making it much more difficult to verify and test these devices, and to sign off with confidence. In addition to timing and clock domain crossing issues, which are becoming much more difficult to deal with in complex chips, some of the new devices are including AI, machine learning or deep learning... » read more

Carmakers To Chipmakers: Where’s The Data?

By Ed Sperling And Susan Rambo - 24 Oct, 2018 - Comments: 0

The integration of electronics into increasingly autonomous vehicles isn't going nearly as smoothly as the marketing literature suggests. In fact, it could take years before some of these discrepancies are resolved. The push toward full autonomy certainly hasn't slowed down, but carmakers and the electronics industry are approaching that goal from very different vantage points. Carmakers and... » read more

Foundries Accelerate Auto Efforts

By Mark LaPedus - 20 Jul, 2017 - Comments: 0

Foundries are ramping up their efforts in automotive chip production in preparation for a surge in semiconductors used in assisted and autonomous driving. All of the major foundry vendors are scrambling to assemble the pieces and expand their process portfolios for automotive customers. The foundries are seeing a growing demand from automotive IC customers amid the push toward advanced drive... » read more

The LiDAR Gold Rush

By Jeff Dorsch - 12 Jun, 2017 - Comments: 0

Big money is pouring into the LiDAR market, as carmakers gear up for autonomous and assisted driving. LiDAR, along with advanced computer vision and radar sensors, is an essential component for vehicles to maneuver without hitting obstacles or other cars. LiDAR is an acronym for light imaging, detection, and ranging, and until now it has been almost synonymous with next-generation automotive... » read more

Intel To Buy Mobileye

By Ed Sperling - 13 Mar, 2017 - Comments: 2

Intel today said it would acquire embedded vision leader Mobileye for roughly $15.3 billion in equity—$14.7 billion in "enterprise value"—setting the stage for a huge push by the chipmaker into the autonomous driving market. Intel has been dabbling in the automotive market for some time, starting with an unsuccessful bid to replace 8-bit microcontrollers with low-end processors. With the... » read more

Aftermarket Autonomous Vehicle Race Heats Up

By Ann Mutschler - 06 Oct, 2016 - Comments: 0

It’s not just car companies that are racing to build self-driving vehicles. An entire ecosystem is sprouting up around retrofitting existing vehicles with autonomous technology, despite the fact that the technology, infrastructure, regulatory and insurance issues are still not fully formed. Uber already is using self-driving taxis, accompanied by a human driver, in Pittsburgh, Pa. And many... » read more

Predictions For 2016: Markets

By Brian Bailey - 14 Jan, 2016 - Comments: 0

Seventeen companies sent in their predictions for this year with some of them sending predictions from several people. This is in addition to the CEO predictions that were recently published. That is a fine crop of views for the coming year, especially since they know that they will be held accountable for their views and this year, just like the last, they will have to answer for them. We beli... » read more

Automotive Electronic Power

By Barry Pangrle - 27 Jul, 2015 - Comments: 2

Nick Hendricks: I was drag racing. I'm a drag racer. Detective Samson: You were drag racing. Nick Hendricks: [nods] Detective Samson: In a Prius. Nick Hendricks: I don't win a lot. —Horrible Bosses (2011) Automobiles are now a platform for multiple electronic devices. From controllers for complex hybrid drive systems like those found in the Toyota Prius to all types of entertainment s... » read more

Week In Review: System-Level Design

By Ed Sperling - 07 Feb, 2014 - Comments: 0

Cadence agreed to buy Forte Design Systems for an undisclosed sum, adding further proof that the market for high-level synthesis and tools that run at higher levels of abstraction is finally hitting its stride. Behind this acquisition is a rising pain level due to increasing complexity in SoCs—IP integration, low power concerns and much more of everything, from transistors to memories—has f... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?