In-Memory Computing Challenges Come Into Focus


For the last several decades, gains in computing performance have come by processing larger volumes of data more quickly and with superior precision. Memory and storage space are measured in gigabytes and terabytes now, not kilobytes and megabytes. Processors operate on 64-bit rather than 8-bit chunks of data. And yet the semiconductor industry’s ability to create and collect high quality ... » read more

What’s the Right Path For Scaling?


The growing challenges of traditional chip scaling at advanced nodes are prompting the industry to take a harder look at different options for future devices. Scaling is still on the list, with the industry laying plans for 5nm and beyond. But less conventional approaches are becoming more viable and gaining traction, as well, including advanced packaging and in-memory computing. Some option... » read more

What Makes A Chip Design Successful Today?


"Transistors are free" was the rallying cry of the semiconductor industry during the 1990s and early 2000s. That is no longer true. The end of Dennard scaling made the simultaneous use of all the transistors troublesome, but transistors remained effectively unlimited. This led to an era where large amounts of flexibility could be built into a chip. It didn't matter if all of it was being use... » read more

What Comes After Moore’s Law And Dennard Scaling?


For decades, Moore’s Law has been an important semiconductor industry mainstay that has helped fuel a relentless progression in computing performance. However, most industry experts agree that Moore’s Law is waning, with an end on the horizon due to a combination of physical limitations and economic factors. With the loss of Dennard Scaling roughly 10 years ago, the industry is at a critica... » read more

Upcoming Hurdles For The Semiconductor Industry


Semiconductor Engineering sat down to discuss upcoming challenges and hurdles to overcome for the semiconductor industry with Vic Kulkarni, senior vice president and general manager, RTL Power Business at Ansys; Chris Rowen, Fellow and CTO, IP Group at Cadence; Subramani Kengeri, vice president, Global Design Solutions at GLOBALFOUNDRIES; Simon Davidmann, CEO of Imperas Software; Michael Buehle... » read more

Litho Challenges Break The Design-Process Wall


The days when chip designers could throw tape “over the wall” to the manufacturing side are long gone. Over the last several technology generations, increasingly restrictive process kits have forced designers to accommodate their circuit structures to the manufacturing process. Lacking a successor to 193nm lithography, the industry has turned to increasingly complex resolution enhancemen... » read more

One-On-One: Dark Silicon


Professor Michael Taylor’s research group at UC San Diego is studying ways to exploit dark silicon to optimize circuit designs for energy efficiency. He spoke with Semiconductor Engineering about the post-Dennard scaling regime, energy efficiency from integrated circuits all the way up to data centers, and how the manufacturing side can help. What follows are excerpts of that conversation. (F... » read more

Computer Vision’s Enormous Challenges Ahead


SAN FRANCISCO — There is a constant, humming tension between what Moore's Law delivers and what consumers expect from electronics systems design. We're on the verge of seeing this in the coming decade in computer vision, an application that has enormous potential to transform society. In the meantime, enormous challenges and decisions lie ahead on the road to transformation. Embedded Vi... » read more