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Holistic Die-to-Die Interface Design Methodology for 2.5-D Multichip-Module Systems


Abstract: "More than Moore technologies can be supported by system-level diversification enabled by chiplet-based integrated systems within multichip modules (MCMs) and silicon interposer-based 2.5-D systems. The division of large system-on-chip dies into smaller chiplets with different technology nodes specific to the chiplet application requirement enables the performance enhancement at the ... » read more

Generative Design for Autonomous Vehicle Electrical Systems


The massive complexity inherent in autonomous vehicle design will push the tools and methodologies used by automotive engineers to their limits. This is especially true in the electrical and electronic systems domains as they come to dominate the operation of a vehicle’s safety-critical systems and amenities. To compete, autonomous car manufacturers will need a new design methodology that ena... » read more