Week In Review: Design, Low Power


Cadence debuted Denali Gen2 IP for LPDDR5/4/4X in TSMC's 7nm FinFET process technology. The offering consists of PHY, controller and Verification IP. It supports both the pre-release LPDDR5 standard and LPDDR4/4X devices as well as Arm AMBA AXI buses and reliability features like in-line error correcting codes. The LPDDR5 standard provides up to 1.5x bandwidth over LPDDR4 and LPDDR4X. The US... » read more

Week in Review: IoT, Security, Auto


Deals Dialog Semiconductor made a blockbuster deal with Apple – the chip company will license power management technologies and transfer some assets to Apple, which will use them in their internal chip research and development. More than 300 Dialog employees, mostly engineers, will join Apple, which will pay $300 million in cash for the transaction and prepay another $300 million for Dialog ... » read more

Investors Back IoT Startups


Internet of Things startups took in more than $1.35 billion from corporate and private investors during the latter half of 2017, for a total of about $2.2 billion in the full year. Chicago-based Uptake Technologies, an Industrial IoT startup, had the biggest haul of the year, with $117 million raised in a Series D round, on top of a $90 million Series C round earlier in 2017, bringing its to... » read more

The Week in Review: IoT


Investment The city of Dresden, Germany, is touting its prospects as a tech hub in the “Silicon Saxony” ecosystem, particularly for Internet of Things technology. Bosch, the German Aerospace Center, GlobalFoundries, Infineon Technologies, and other organizations are planning to invest about €4.5 billion (approximately $5.3 billion) over several years to develop processors, sensors, and 5... » read more

The Week In Review: Manufacturing


Test, measurement and fab tools National Instruments (NI) has released a report that explores the future trends in the electronics industry. The report, called the NI Trend Watch 2018, looks at the technological advances and some of the biggest challenges engineers face in 2018. The report from NI looks at the following topics—machine learning; test challenges for 5G; IIoT; and effects of... » read more

The Week in Review: IoT


Finance Mountain View, Calif.-based FogHorn Systems has received Series B funding of $30 million, led by Intel Capital and Saudi Aramco Energy Ventures. The new round brings the Industrial Internet of Things edge computing startup’s total funding to $47.5 million. Honeywell Ventures is a new investor, joining existing investors Darling Ventures, Dell Technologies Capital, GE Ventures, March ... » read more

Analog Meets Power In Standards Groups


While the topic of language [getkc id="13" comment="Standards"] might be cringe-worthy for some, there is some noteworthy work underway in this area—particularly where power and analog meet paths. There are four main standards here: Verilog-A and Verilog-AMS VHDL-AMS SystemC-AMS SystemVerilog-AMS SystemVerilog-AMS is the newcomer, and while the standard won't be available for ... » read more

The Week In Review: Design


Tools CEVA integrated Bluetooth processing into its DSP cores. In addition to audio and video and always-on capabilities, the company is pitching the combination as an all-in-one, ultra-low-power solution for the wearable electronics market. So how big is this market opportunity? IDC predicts the wearable computing market will grow from 19.2 million units this year to 112 million units in 2... » read more

Test Challenges Rising For Mobile Devices


Smartphone and tablets continue to advance at a dizzying pace. On the component side alone, the latest mobile devices are moving towards 64-bit application processors, multi-mode RF front-ends, higher-end cameras and flashy LCD screens. Some systems even boast fingerprint scanners and heart rate sensors. But an obvious part of the system continues to lag behind the curve—battery life. In r... » read more

The Week In Review: Sept. 13


By Ed Sperling Cadence unveiled its next-generation emulation platform, greatly boosting the speed by up to 60x for embedded OS verification and by up to 10x for hardware/software verification. Overall, Cadence says the platform doubles verification productivity with a capacity of up to 2.3 billion gates. Cadence also reported that its mixed-signal LP flow allowed Silicon Labs to cut its MCU p... » read more

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