The Week In Review: Manufacturing

By Mark LaPedus - 02 Oct, 2015 - Comments: 0

Upgraded components in the new iPhone 6S Plus from Apple cost $16 more than the components in the earlier iPhone 6 Plus, according to IHS, which also provided a breakdown of the phone. Both Samsung and TSMC are making Apple’s A9 applications processor on a foundry basis, according to ExtremeTech, which cites Chipworks as its source. There are reports that the Chinese government is interes... » read more

The Week In Review: Design/IoT

By Ed Sperling - 04 Sep, 2015 - Comments: 0

IP Synopsys rolled out logic library and embedded memory IP for the Mie Fujitsu 40nm low-power process. The process has 50% lower power consumption compared with previous process technologies. Deals Rambus' Cryptography Research Division won a deal to run the Secure Content Storage Association's cryptographic key management center. The keys are used in SCSA-enabled devices for securing vid... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 04 Sep, 2015 - Comments: 0

GlobalFoundries has partnered with Catena, a supplier of radio frequency (RF) communication IPs, to offer complete Wi-Fi and Bluetooth solutions for system-on-chip (SoC) designers targeting mobile, Internet-of-Things (IoT), RF connectivity markets. In addition, GlobalFoundries and QEOS are partnering to co-develop the industry’s first mmW CMOS platform. Samsung Electronics said that its 20... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

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The Week In Review: Manufacturing

The Week In Review: Design/IoT

The Week In Review: Manufacturing