Making 3D Structures And Packages More Reliable


The move to smaller vertical structures and complex packaging schemes is straining existing testing approaches, particularly in heterogeneous combinations on a single chip and in multi-die packages. The complexity of these devices has exploded with the slowdown in scaling, as chipmakers turn to architectural solutions and new transistor structures rather than just relying on shrinking featur... » read more

Using Machine Learning To Break Down Silos


Jeff David, vice president of AI solutions at PDF Solutions, talks with Semiconductor Engineering about where machine learning can be applied into semiconductor manufacturing, how it can be used to break down silos around different process steps, how active learning works with human input to tune algorithms, and why it’s important to be able to choose different different algorithms for differ... » read more

Domain Expertise Becoming Essential For Analytics


Sensors are being added into everything, from end devices to the equipment used to make those sensors, but the data being generated has limited or no value unless it's accompanied by domain expertise. There are two main problems. One is how and where to process the vast amount of data being generated. Chip and system architectures are being revamped to pre-process more of that data closer to... » read more