Using Memory Differently To Boost Speed


Boosting memory performance to handle a rising flood of data is driving chipmakers to explore new memory types and different ways of using existing memory, but it also is creating some complex new challenges. For most of the semiconductor design industry, memory has been a non-issue for the past couple of decades. The main concerns were price and size, but memory makers have been more than a... » read more

China’s Latest Goal—More DRAMs


China is once again making a concerted effort to get its domestic DRAM industry off the ground. Past efforts have fallen short or failed. This time around, it’s unclear if China will succeed, but the industry should pay close attention here. So why would China want to play a bigger role in the tough and competitive DRAM business? For one thing, the U.S. and China are in the midst of a t... » read more

Will In-Memory Processing Work?


The cost associated with moving data in and out of memory is becoming prohibitive, both in terms of performance and power, and it is being made worse by the data locality in algorithms, which limits the effectiveness of cache. The result is the first serious assault on the von Neumann architecture, which for a computer was simple, scalable and modular. It separated the notion of a computatio... » read more

Inferencing Efficiency


Geoff Tate, CEO of Flex Logix, talks with Semiconductor Engineering about how to measure efficiency in inferencing chips, how to achieve the most throughput for the lowest cost, and what the benchmarks really show. » read more

System Bits: June 25


Supercomputers around the world At last week’s International Supercomputing Conference in Frankfurt, Germany, the 53rd biannual list of the Top500 of the most powerful computing systems in the world was released. Broken out by countries of installation, China has 219 of the world’s 500 fastest supercomputers, compared with 116 in the United States. Ranking by percent of list flops, the ... » read more

Copy-Row DRAM (CROW) : Substrate for Improving DRAM


Source/Credit: ETH Zurich & Carnegie Mellon University Click here for the technical paper and here for the power point slides » read more

Falling Chip Forecasts


It’s time to take a pulse of the semiconductor market amid the memory downturn and trade frictions with China. For some time, the DRAM and NAND markets have been hit hard with falling prices and oversupply. Then, the Trump administration last year slapped tariffs on Chinese goods. China retaliated. And the trade war rages on between the U.S. and China. More recently, the U.S. Department... » read more

What’s Next In Advanced Packaging


Packaging houses are readying the next wave of advanced IC packages, hoping to gain a bigger foothold in the race to develop next-generation chip designs. At a recent event, ASE, Leti/STMicroelectronics, TSMC and others described some of their new and advanced IC packaging technologies, which involve various product categories, such as 2.5D, 3D and fan-out. Some new packaging technologies ar... » read more

Playing Into China’s Hands


The fallout over blacklisting Huawei in particular, and China in general, has set the tone for a nasty global race. But it is almost certain to produce a different result than the proponents of a trade war are expecting. The idea behind tariffs and the blacklisting of Huawei is to starve China of vital technology. So far, the impact has been minimal. Reports from inside of China are equa... » read more

HBM2e Offers Solid Path For AI Accelerators


Today, AI processors are so blazingly fast that they’re constantly having to wait for data from memory. Unfortunately, with the status quo, memory is just not fast enough to unleash the true performance of those new and highly advancing AI processors. In simple terms, AI processor performance is rapidly growing, and memory is not keeping up. This creates a bottleneck, or what Rambus calls the... » read more

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