tag: DRAM

It’s a Materials World, With Positive Forecast
By SEMI - 23 Jul, 2015 - Comments: 0

By Michael Fury What’s the latest in materials forecasts for ALD/CVD precursors, CMP consumables, electronic gases, silicon wafers and sputtering targets? Techcet gives us an update. Metal Gate and Electrode Precursors to Double in Five Years Use of front-end Ta and W metal gate and Hf gate dielectric precursors will grow over 2.5x by 2020, according to a new report from Techcet, “20... » read more

Moore Memory Problems
By Brian Bailey - 09 Jul, 2015 - Comments: 0

The six-transistor static memory cell (SRAM) has been the mainstay of on-chip memory for several decades and has stood the test of time. Today, many advanced SoCs have 50% of the chip area covered with these memories and so they are critical to continued scaling. “The SRAM being used in modern systems is similar to the SRAM they were using in the 1970s and 1980s,” says Duncan Bremner, ch... » read more

Don’t Let The Headlines Trick You
By Loren Shalinsky - 09 Jul, 2015 - Comments: 0

This is the time of year when reports get issued summarizing the sales results of the server market in the first quarter. As a way of grabbing attention, many of the headlines will mention that the results of the first quarter are below those of the fourth quarter, bringing to mind all sorts of doomsday scenarios. Don’t be fooled. In many industries, sales exhibit a large seasonal compo... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 19 Jun, 2015 - Comments: 0

Since the global economic recession of 2008-2009, the IC industry has pared down older fab capacity. From 2009-2014, semiconductor manufacturers have closed or repurposed 83 wafer fabs, including a few 300mm plants, according to IC Insights. Are 3D DRAMs finally here? SK Hynix is shipping mass production volumes of its first-generation High Bandwidth Memory (HBM1). Samsung is also backing it... » read more

10nm Fab Watch
By Mark LaPedus - 21 May, 2015 - Comments: 1

When will the 10nm logic node happen? Analysts believe that foundry vendors will move into 10nm finFET volume production around 2017. Still others say the 10nm finFET ramp could take place anywhere from 2018 to 2020. The predictions are all over the map. One way to predict the timing, progress and demand for 10nm is simple: Follow the fabs. In fact, Intel, Samsung, TSMC and GlobalFound... » read more

How Is Your HBM Memory?
By Frank Ferro - 14 May, 2015 - Comments: 0

The seemingly countless applications used every day requiring web access (social media, streaming video, games, etc.) are not only driving the need to store a tremendous amount of data, but also driving the need to access this data with as little delay as possible. Add to this list the growing number of connected devices (IoT), and you can see why changes in the data center are needed, in parti... » read more

Architecturally Optimizing Memory Bandwidth
By Ann Mutschler - 27 Mar, 2015 - Comments: 0

Making sure that an SoC’s [getkc id="22" kc_name="memory"] bandwidth is optimized is a crucial part of the design process today given its significance toward overall system performance. There are many ways to approach this issue, and all of them can have a direct bearing on the competitiveness of a chip in terms of both power and performance. So where should you start? “Number one, c... » read more

Rethinking The Cloud
By Ed Sperling - 12 Mar, 2015 - Comments: 0

Data center architectures have seen very few radical changes since the commercial introduction of the [getentity id="22306" comment="IBM"] System/360 mainframe in 1964. There have been incremental improvements in speed and throughput over the years, with a move to a client/server model in the 1990s, but from a high level this is still an environment where data is processed and stored centrally ... » read more

Darker Silicon
By Katherine Derbyshire - 29 Jan, 2015 - Comments: 0

For the last several decades, integrated circuit manufacturers have focused their efforts on [getkc id="74" comment="Moore's Law"], increasing transistor density at constant cost. For much of that time, Dennard’s Law also held: As the dimensions of a device go down, so does power consumption. Smaller transistors ran faster, used less power, and cost less. As most readers already know, howe... » read more

Manufacturing And Packaging Changes For 2015
By Brian Bailey - 22 Jan, 2015 - Comments: 0

This year more than 26 people provided predictions for 2015. Most of these came from the EDA industry, so the results may be rather biased. However, ecosystems are coming closer together in many parts of the semiconductor food chain, meaning that the EDA companies often can see what is happening in dependent industries and in the system design houses. Thus their predictions may have already res... » read more

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