High-NA Lithography Starting To Take Shape

By Gregory Haley - 25 Jul, 2023 - Comments: 3

The future of semiconductor technology is often viewed through the lenses of photolithography equipment, which continues to offer better resolution for future process nodes despite an almost perpetual barrage of highly challenging technological issues. For years, lithography was viewed as the primary manufacturing-related gating factor to continued device scaling, beset by multiple delays th... » read more

The High Price Of Smaller Features

By Katherine Derbyshire - 15 Sep, 2022 - Comments: 0

The semiconductor industry’s push for higher numerical apertures is driven by the relationship between NA and critical dimension. As the NA goes up, the CD goes down: Where λ is the wavelength and k1 is a process coefficient. While 0.55 NA exposure systems will improve resolution, Larry Melvin, principal engineer at Synopsys, noted that smaller features always come with a process cos... » read more

What’s Next In Fab Tool Technologies?

By Mark LaPedus - 12 May, 2021 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss extreme ultraviolet (EUV) lithography and other next-generation fab technologies with Jerry Chen, head of global business development for manufacturing & industrials at Nvidia; David Fried, vice president of computational products at Lam Research; Mark Shirey, vice president of marketing and applications at KLA; and Aki Fuj... » read more

Why New Photoresist Technology Is Critical

By Rich Wise - 18 Mar, 2021 - Comments: 0

As chipmakers move to advanced technology nodes, they are challenged to resolve ever finer features. One of the major roadblocks involves the material used to transfer chip design to the wafer. That material is rapidly reaching its limit to accurately transfer designs. To keep next-generation device scaling on track, a breakthrough technology has been introduced: dry resist. To better understan... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 28 Feb, 2020 - Comments: 2

SPIE At the SPIE Advanced Lithography conference, Lam Research has introduced a new dry resist technology for extreme ultraviolet (EUV) lithography. Dry resist technology is a new approach to deposit and develop EUV resists. It is a dry deposition technique with alternate compositions and mechanisms. By combining Lam’s deposition and etch process expertise with partnerships with ASML a... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Dry resist

High-NA Lithography Starting To Take Shape

The High Price Of Smaller Features

What’s Next In Fab Tool Technologies?

Why New Photoresist Technology Is Critical

Week In Review: Manufacturing, Test

Trending Articles

Hybrid Bonding Makes Strides Toward Manufacturability

Americas Chip Funding Energizes Industry

Advanced Packaging Driving New Collaboration Across Supply Chain

Chiplets Make Progress Using Interconnects As Glue

2D Semiconductors Make Progress, But So Does Silicon

Knowledge Centers
Entities, people and technologies explored