中文 English

What’s Next In Fab Tool Technologies?


Experts at the Table: Semiconductor Engineering sat down to discuss extreme ultraviolet (EUV) lithography and other next-generation fab technologies with Jerry Chen, head of global business development for manufacturing & industrials at Nvidia; David Fried, vice president of computational products at Lam Research; Mark Shirey, vice president of marketing and applications at KLA; and Aki Fuj... » read more

Why New Photoresist Technology Is Critical


As chipmakers move to advanced technology nodes, they are challenged to resolve ever finer features. One of the major roadblocks involves the material used to transfer chip design to the wafer. That material is rapidly reaching its limit to accurately transfer designs. To keep next-generation device scaling on track, a breakthrough technology has been introduced: dry resist. To better understan... » read more

Week In Review: Manufacturing, Test


SPIE At the SPIE Advanced Lithography conference, Lam Research has introduced a new dry resist technology for extreme ultraviolet (EUV) lithography. Dry resist technology is a new approach to deposit and develop EUV resists. It is a dry deposition technique with alternate compositions and mechanisms. By combining Lam’s deposition and etch process expertise with partnerships with ASML a... » read more