Why packaging is becoming increasingly critical and difficult in the automotive market.

Most attacks in the past focused on gaining access to software, but Meltdown and Spectre have changed that forever.

Academia, startups and technology giants are addressing health care through collaboration, creativity, and tremendous compute power.

Old problem is becoming more difficult to resolve at each new node; mitigation measures being developed.

From harvesting robots to tractors without cabs, autonomy has already reached the agricultural industry.

As advanced-node chips are added into cars, and usage models shift inside of data centers, new questions surface about reliability.

This more than Moore technology is still ramping up, and problems need to be solved, but it could lead to some fundamental changes.

Cost of porting tools and IP will limit choices at partial nodes and create confusion at others.

The race is on to simulate thermal and electromagnetic effects.

Are optimizations really a zero sum gain? Where to gamble and when to play it safe.

Why new approaches are needed to tie together training and inferencing.

Heat is becoming a bigger problem for chips developed at new process nodes and for automotive and industrial applications.

The next-gen wireless technology is riddled with problems, but that hasn’t slowed the pace of development.