tag: eBeam Initiative

What’s Changing At BACUS
By Jan Willis - 17 Aug, 2017 - Comments: 0

Jim Wiley, president of SPIE BACUS, talks about this year's merger of the EUV Lithography Symposium and the SPIE Photomask Conference—including what's new and different, the latest updates on the event location, and topics to look forward to such as EUV mask inspection—as well as his predictions on machine learning. https://youtu.be/GNxUmMAU9zs » read more

Inside Lithography And Masks
By Mark LaPedus - 05 Apr, 2017 - Comments: 3

Semiconductor Engineering sat down to discuss lithography and photomask technologies with Gregory McIntyre, director of the Advanced Patterning Department at [getentity id="22217" e_name="Imec"]; Harry Levinson, senior fellow and senior director of technology research at [getentity id="22819" comment="GlobalFoundries"]; David Fried, chief technology officer at [getentity id="22210" e_name="Cove... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 31 Mar, 2017 - Comments: 0

Chipmakers At an event, Intel’s Technology and Manufacturing group outlined the company's vision. As part of the event, Intel reiterated what many are saying—the current node designations are meaningless and misleading. “For example, Intel estimates that its 14nm solution that has been out in the market since 2014 should be equal to 10nm solutions released by competitors in the near futu... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 24 Mar, 2017 - Comments: 0

Chipmakers China’s IC industry is embarking on a recruitment drive to prepare for the operation of new fabs in 2018, according to TrendForce. “TrendForce’s latest analysis on China’s semiconductor sector reveals that the country’s domestic IC manufacturers are affecting the movement of industry talent worldwide as they continue to aggressively headhunt for senior managers and enginee... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 03 Mar, 2017 - Comments: 2

SPIE news At this week’s SPIE Advanced Lithography conference, the industry paid close attention to the progress of extreme ultraviolet (EUV) lithography. Here’s the general report card: EUV is making noticeable progress, but there are still some challenges ahead, such as the power source, resists and pellicles. Several issues need to be resolved before chipmakers can put EUV into mass... » read more

Will GPU-Acceleration Mean The End Of Empirical Mask Models?
By Ryan Pearman - 20 Oct, 2016 - Comments: 0

Shrinking mask feature sizes and increasing proximity effects are driving the adoption of simulation-based mask processing. Empirical models have been most widely used to date, because they are faster to simulate. Today, GPU-acceleration is enabling fast simulation using physical models. Does the ability of GPU-acceleration to make physical models a practical solution mean the end of empirical ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 14 Oct, 2016 - Comments: 0

Chipmakers Alain Kaloyeros, president of SUNY Polytechnic Institute, has resigned. This comes amid charges that Kaloyeros was involved in an alleged bid-rigging scheme, according to multiple reports. SUNY Poly, a high-tech educational ecosystem in New York, was recently formed from the merger of the SUNY College of Nanoscale Science and Engineering (CNSE) and the SUNY Institute of Technology. ... » read more

5 Takeaways From BACUS
By Mark LaPedus - 22 Sep, 2016 - Comments: 0

As usual, the recent SPIE Photomask Technology Conference, sometimes called BACUS, was a busy event. The event, which took place in San Jose, Calif., featured presentations on the usual subjects in the photomask sector. There were presentations on mask writers, inspection, metrology, repair and cleaning. And, of course, the papers included masks based on extreme ultraviolet (EUV) lithography... » read more

Mask Maker Worries Grow
By Mark LaPedus - 22 Sep, 2016 - Comments: 0

Photomasks are becoming more complex and expensive at each node, thereby creating a number of challenges on several fronts. For one thing, the features on the [getkc id="265" kc_name="photomask"] are becoming smaller and more complex at each node. Second, the number of masks per mask-set are increasing as a result of multiple patterning. Third, it costs more to build and equip a new mask fab... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 16 Sep, 2016 - Comments: 0

Chipmakers The finFET market is heating up. GlobalFoundries, Intel, Samsung and TSMC are ramping 16nm/14nm finFETs. And 10nm and 7nm finFETs are in the works. The market will shortly have a new competitor—Taiwan’s United Microelectronics Corp. (UMC). Some years ago, UMC licensed finFET technology from IBM. UMC has been a bit quiet about the 14nm finFET technology, but it has made si... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2025 SMG   |  Terms of Service  |  Privacy Policy